Part Details for GS816236DD-200M by GSI Technology
Results Overview of GS816236DD-200M by GSI Technology
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
GS816236DD-200M Information
GS816236DD-200M by GSI Technology is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 10018783-10200MLF | Amphenol Communications Solutions | PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch | |
| 10018783-00200MLF | Amphenol Communications Solutions | PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch | |
| 10018783-11200MLF | Amphenol Communications Solutions | PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch |
Price & Stock for GS816236DD-200M
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS816236DD-200M
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Avnet Americas | SRAM Chip Sync Quad 2.5V/3.3V 18M-Bit 512K x 36 6.5ns/3ns 165-Pin FBGA Bulk - Trays (Alt: GS816236DD-200M) COO: Taiwan (Province of China) RoHS: Not Compliant Min Qty: 36 Package Multiple: 1 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
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$67.2840 / $77.6160 | Buy Now |
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DISTI #
464-GS816236DD-200M
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Mouser Electronics | SRAM 2.5 or 3.3V 512K x 36 18M | 0 |
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$80.5200 | Order Now |
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DISTI #
GS816236DD-200M
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Avnet Silica | SRAM Chip Sync Quad 25V33V 18MBit 512K x 36 65ns3ns 165Pin FBGA Bulk (Alt: GS816236DD-200M) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 27 Weeks, 0 Days | Silica - 0 |
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Buy Now |
US Tariff Estimator: GS816236DD-200M by GSI Technology
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for GS816236DD-200M
GS816236DD-200M Part Data Attributes
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GS816236DD-200M
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS816236DD-200M
GSI Technology
Cache SRAM, 512KX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Package Description | Lbga, | |
| Reach Compliance Code | Compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| Access Time-Max | 6.5 Ns | |
| Additional Feature | It Also Operates At 3.3 V Nominal Supply Voltage | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 15 Mm | |
| Memory Density | 18874368 Bit | |
| Memory IC Type | Cache Sram | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 524288 Words | |
| Number of Words Code | 512000 | |
| Operating Mode | Synchronous | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512kx36 | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | LBGA | |
| Package Shape | Rectangular | |
| Package Style | Grid Array, Low Profile | |
| Parallel/Serial | Parallel | |
| Peak Reflow Temperature (Cel) | Not Specified | |
| Seated Height-Max | 1.4 Mm | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Military | |
| Terminal Form | Ball | |
| Terminal Pitch | 1 Mm | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | Not Specified | |
| Width | 13 Mm |
GS816236DD-200M Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the GS816236DD-200M is -40°C to +85°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of 0°C to 70°C for optimal performance and reliability.
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To ensure data integrity and prevent data corruption during power-up and power-down cycles, it's recommended to follow a controlled power-up and power-down sequence, as specified in the datasheet. Additionally, using a voltage supervisor or a power-on reset circuit can help to ensure that the device is properly initialized and configured before accessing the memory.
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The recommended clock frequency for the GS816236DD-200M is up to 200 MHz, and the clock-to-output delay (tCKO) is typically around 2-3 ns. However, the actual clock frequency and clock-to-output delay may vary depending on the specific application and system requirements.
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To handle asynchronous clock domains and clock domain crossing (CDC) issues with the GS816236DD-200M, it's recommended to use clock domain crossing circuits or synchronizers to ensure that the clock signals are properly synchronized and aligned between different clock domains. Additionally, using FIFOs or other CDC techniques can help to mitigate CDC issues.
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The recommended termination scheme for the GS816236DD-200M's output pins is to use a 50-ohm termination resistor to VCC or VSS, depending on the specific application and signal requirements. This helps to reduce signal reflections and improve signal integrity.