Datasheets
GS82582QT19RE-250M by: GSI Technology

QDR II Plus SRAM, 16MX18, 0.45ns, CMOS, PBGA165

Part Details for GS82582QT19RE-250M by GSI Technology

Results Overview of GS82582QT19RE-250M by GSI Technology

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Applications Computing and Data Storage Financial Technology (Fintech) Electronic Manufacturing Automotive

GS82582QT19RE-250M Information

GS82582QT19RE-250M by GSI Technology is an SRAM.
SRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
TPS73250MDBVREP Texas Instruments Enhanced Product Cap-Free Nmos 250-Ma Ldo Regulator With Reverse Current Protection 5-SOT-23 -55 to 125
LP591250MDRVREP Texas Instruments Enhanced-product, 500-mA low-noise low-IQ low-dropout regulator with reverse current pr 6-WSON -55 to 125

Price & Stock for GS82582QT19RE-250M

Part # Distributor Description Stock Price Buy
DISTI # GS82582QT19RE-250M
Avnet Americas SRAM Chip Synchronous 1.8V 288M-bit 16M x 18 250MHz 165-Pin BGA - Trays (Alt: GS82582QT19RE-250M) COO: Taiwan (Province of China) RoHS: Not Compliant Min Qty: 10 Package Multiple: 1 Lead time: 24 Weeks, 0 Days Container: Tray 0
  • 10 $6,314.0000
  • 20 $6,068.0000
  • 40 $5,822.0000
  • 80 $5,576.0000
  • 160 $5,473.5000
$5,473.5000 / $6,314.0000 Buy Now

US Tariff Estimator: GS82582QT19RE-250M by GSI Technology

Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.

GS82582QT19RE-250M
GSI Technology
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Part Details for GS82582QT19RE-250M

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GS82582QT19RE-250M Part Data Attributes

GS82582QT19RE-250M GSI Technology
Buy Now Datasheet
Compare Parts:
GS82582QT19RE-250M GSI Technology QDR II Plus SRAM, 16MX18, 0.45ns, CMOS, PBGA165
Part Life Cycle Code Active
Package Description Lbga, Bga165,11x15,40
Reach Compliance Code Compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 Ns
Clock Frequency-Max (fCLK) 250 Mhz
I/O Type Common
JESD-30 Code R-PBGA-B165
Length 17 Mm
Memory Density 301989888 Bit
Memory IC Type Qdr Ii Plus Sram
Memory Width 18
Number of Functions 1
Number of Terminals 165
Number of Words 16777216 Words
Number of Words Code 16000000
Operating Mode Synchronous
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 16mx18
Output Characteristics 3-State
Output Enable No
Package Body Material Plastic/Epoxy
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape Rectangular
Package Style Grid Array, Low Profile
Parallel/Serial Parallel
Seated Height-Max 1.5 Mm
Standby Current-Max 0.52 A
Standby Voltage-Min 1.7 V
Supply Current-Max 1.03 Ma
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount Yes
Technology Cmos
Temperature Grade Military
Terminal Form Ball
Terminal Pitch 1 Mm
Terminal Position Bottom
Total Dose 50k Rad(Si) V
Width 15 Mm
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