Part Details for GS8662Q09BD-250I by GSI Technology
Overview of GS8662Q09BD-250I by GSI Technology
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (7 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for GS8662Q09BD-250I
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS8662Q09BD-250I
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Tray - Bulk (Alt: GS8662Q09BD-250I) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$73.6464 / $90.6840 | Buy Now |
DISTI #
464-GS8662Q09BD-250I
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Mouser Electronics | SRAM 1.8 or 1.5V 8M x 9 72M | 0 |
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$82.4800 / $86.1500 | Order Now |
DISTI #
GS8662Q09BD-250I
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Tray - Bulk (Alt: GS8662Q09BD-250I) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$73.6464 / $90.6840 | Buy Now |
Part Details for GS8662Q09BD-250I
GS8662Q09BD-250I CAD Models
GS8662Q09BD-250I Part Data Attributes:
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GS8662Q09BD-250I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8662Q09BD-250I
GSI Technology
QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | LBGA, BGA165,11X15,40 | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 24 Weeks | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 250 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e0 | |
Length | 15 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 9 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8MX9 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.73 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |
Alternate Parts for GS8662Q09BD-250I
This table gives cross-reference parts and alternative options found for GS8662Q09BD-250I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662Q09BD-250I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
CY7C1525KV18-250BZXI | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | GS8662Q09BD-250I vs CY7C1525KV18-250BZXI |
CY7C1525JV18-250BZI | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662Q09BD-250I vs CY7C1525JV18-250BZI |
CY7C1525KV18-250BZXI | QDR II SRAM, 8MX9, 0.45ns, CMOS, PBGA165, | Infineon Technologies AG | GS8662Q09BD-250I vs CY7C1525KV18-250BZXI |
K7R640982M-EI250 | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 | Samsung Semiconductor | GS8662Q09BD-250I vs K7R640982M-EI250 |
CY7C1525JV18-250BZXI | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662Q09BD-250I vs CY7C1525JV18-250BZXI |
K7R640982M-FI250 | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 | Samsung Semiconductor | GS8662Q09BD-250I vs K7R640982M-FI250 |
GS8662Q09BGD-250I | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662Q09BD-250I vs GS8662Q09BGD-250I |