Datasheets
GS8662Q09BD-250IT by: GSI Technology

QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165

Part Details for GS8662Q09BD-250IT by GSI Technology

Overview of GS8662Q09BD-250IT by GSI Technology

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Part Details for GS8662Q09BD-250IT

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GS8662Q09BD-250IT Part Data Attributes:

GS8662Q09BD-250IT GSI Technology
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GS8662Q09BD-250IT GSI Technology QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 250 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e0
Length 15 mm
Memory Density 75497472 bit
Memory IC Type QDR SRAM
Memory Width 9
Number of Functions 1
Number of Terminals 165
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8MX9
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Voltage-Min 1.7 V
Supply Current-Max 0.73 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm

Alternate Parts for GS8662Q09BD-250IT

This table gives cross-reference parts and alternative options found for GS8662Q09BD-250IT. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662Q09BD-250IT, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C1525KV18-250BZXI QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, FBGA-165 Cypress Semiconductor GS8662Q09BD-250IT vs CY7C1525KV18-250BZXI
CY7C1525JV18-250BZI QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662Q09BD-250IT vs CY7C1525JV18-250BZI
CY7C1525KV18-250BZXI QDR II SRAM, 8MX9, 0.45ns, CMOS, PBGA165, Infineon Technologies AG GS8662Q09BD-250IT vs CY7C1525KV18-250BZXI
GS8662Q09BD-250I QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q09BD-250IT vs GS8662Q09BD-250I
K7R640982M-EI250 QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 Samsung Semiconductor GS8662Q09BD-250IT vs K7R640982M-EI250
CY7C1525JV18-250BZXI QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS8662Q09BD-250IT vs CY7C1525JV18-250BZXI
K7R640982M-FI250 QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 Samsung Semiconductor GS8662Q09BD-250IT vs K7R640982M-FI250
GS8662Q09BGD-250I QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662Q09BD-250IT vs GS8662Q09BGD-250I
Part Number Description Manufacturer Compare
GS8662D09BGD-200T Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662Q09BD-250IT vs GS8662D09BGD-200T
GS8662D09BD-300T QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q09BD-250IT vs GS8662D09BD-300T
CY7C1528V18-200BZXC DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS8662Q09BD-250IT vs CY7C1528V18-200BZXC
GS8662R09BGD-250 Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662Q09BD-250IT vs GS8662R09BGD-250
GS8662Q09BGD-357T QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662Q09BD-250IT vs GS8662Q09BGD-357T
GS8662D10BD-400IT DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q09BD-250IT vs GS8662D10BD-400IT
GS8662TT10BGD-450T DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662Q09BD-250IT vs GS8662TT10BGD-450T
GS8662R09BD-167T Standard SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662Q09BD-250IT vs GS8662R09BD-167T
GS8662R09BGD-250T Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662Q09BD-250IT vs GS8662R09BGD-250T
GS8662Q09GE-300I Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662Q09BD-250IT vs GS8662Q09GE-300I

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