Part Details for H26M52208FPR by SK Hynix Inc
Overview of H26M52208FPR by SK Hynix Inc
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Computing and Data Storage
Price & Stock for H26M52208FPR
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Chip1Cloud | Managed NAND Flash Serial e-MMC 16G-bit | 7010 |
|
RFQ | |
|
|
Perfect Parts Corporation | 179 |
|
RFQ |
Part Details for H26M52208FPR
H26M52208FPR CAD Models
H26M52208FPR Part Data Attributes
|
|
H26M52208FPR
SK Hynix Inc
Buy Now
Datasheet
|
Compare Parts:
H26M52208FPR
SK Hynix Inc
Flash, 16GX8, PBGA153, FBGA-153
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SK HYNIX INC | |
| Package Description | VFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| JESD-30 Code | R-PBGA-B153 | |
| Length | 13 mm | |
| Memory Density | 137438953472 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 153 | |
| Number of Words | 17179869184 words | |
| Number of Words Code | 16000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 16GX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3.3 V | |
| Seated Height-Max | 0.8 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 11.5 mm |