Datasheets
H5PS2562GFR-C4J by: SK Hynix Inc

DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA84, 7.50 X 12.50 MM, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84

Part Details for H5PS2562GFR-C4J by SK Hynix Inc

Overview of H5PS2562GFR-C4J by SK Hynix Inc

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Part Details for H5PS2562GFR-C4J

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H5PS2562GFR-C4J Part Data Attributes

H5PS2562GFR-C4J SK Hynix Inc
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H5PS2562GFR-C4J SK Hynix Inc DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA84, 7.50 X 12.50 MM, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code BGA
Package Description TFBGA, BGA84,9X15,32
Pin Count 84
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.24
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.5 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 267 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B84
JESD-609 Code e1
Length 12.5 mm
Memory Density 268435456 bit
Memory IC Type DDR2 DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 84
Number of Words 16777216 words
Number of Words Code 16000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 16MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA84,9X15,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 4,8
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 7.5 mm

Alternate Parts for H5PS2562GFR-C4J

This table gives cross-reference parts and alternative options found for H5PS2562GFR-C4J. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of H5PS2562GFR-C4J, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MT47H16M16BG-5EAT:B DDR DRAM, 16MX16, 0.6ns, CMOS, PBGA84, 8 X 14 MM, ROHS COMPLIANT, FBGA-84 Micron Technology Inc H5PS2562GFR-C4J vs MT47H16M16BG-5EAT:B
K4N56163QF-GC370 DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA84, FBGA-84 Samsung Semiconductor H5PS2562GFR-C4J vs K4N56163QF-GC370
EDE2516AASE-4A-E DDR DRAM, 16MX16, 0.6ns, CMOS, PBGA84, LEAD FREE, FBGA-84 Elpida Memory Inc H5PS2562GFR-C4J vs EDE2516AASE-4A-E
K4N56163QF-ZC330 DDR DRAM, 16MX16, 0.47ns, CMOS, PBGA84, LEAD FREE, FBGA-84 Samsung Semiconductor H5PS2562GFR-C4J vs K4N56163QF-ZC330
MT47H16M16BG-37EL:B DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA84, 8 X 14 MM, ROHS COMPLIANT, FBGA-84 Micron Technology Inc H5PS2562GFR-C4J vs MT47H16M16BG-37EL:B
HY5PS561621LF-E4 DDR DRAM, 16MX16, 0.6ns, CMOS, PBGA84, FBGA-84 SK Hynix Inc H5PS2562GFR-C4J vs HY5PS561621LF-E4
HYB18TC256160BF-5 DDR DRAM, 16MX16, 0.6ns, CMOS, PBGA84, GREEN, PLASTIC, TFBGA-84 Qimonda AG H5PS2562GFR-C4J vs HYB18TC256160BF-5
K4N56163QF-GC33 DDR DRAM, 16MX16, 0.47ns, CMOS, PBGA84, FBGA-84 Samsung Semiconductor H5PS2562GFR-C4J vs K4N56163QF-GC33
HYB18TC256160BF-3.7 DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA84, GREEN, PLASTIC, TFBGA-84 Qimonda AG H5PS2562GFR-C4J vs HYB18TC256160BF-3.7
K4N56163QF-GC200 DDR DRAM, 16MX16, 0.3ns, CMOS, PBGA84, FBGA-84 Samsung Semiconductor H5PS2562GFR-C4J vs K4N56163QF-GC200

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