Part Details for H5PS2G83MFP-Y5 by SK Hynix Inc
Overview of H5PS2G83MFP-Y5 by SK Hynix Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Part Details for H5PS2G83MFP-Y5
H5PS2G83MFP-Y5 CAD Models
H5PS2G83MFP-Y5 Part Data Attributes:
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H5PS2G83MFP-Y5
SK Hynix Inc
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Datasheet
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H5PS2G83MFP-Y5
SK Hynix Inc
DDR DRAM, 256MX8, 0.45ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SK HYNIX INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA60,9X11,32 | |
| Pin Count | 60 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 333 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B60 | |
| JESD-609 Code | e1 | |
| Length | 14 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 60 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 256MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA60,9X11,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.008 A | |
| Supply Current-Max | 0.295 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 12 mm |
Alternate Parts for H5PS2G83MFP-Y5
This table gives cross-reference parts and alternative options found for H5PS2G83MFP-Y5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of H5PS2G83MFP-Y5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MT47H256M8HG-3L:A | DDR DRAM, 256MX8, 0.45ns, CMOS, PBGA60, 11.50 X 14 MM, ROHS COMPLIANT, FBGA-60 | Micron Technology Inc | H5PS2G83MFP-Y5 vs MT47H256M8HG-3L:A |
| MT47H256M8HG-3:C | DDR DRAM, 256MX8, 0.45ns, CMOS, PBGA60, 11.5 X 14 MM, ROHS COMPLIANT, FBGA-60 | Micron Technology Inc | H5PS2G83MFP-Y5 vs MT47H256M8HG-3:C |
| H5PS2G83MFP-S5 | DDR DRAM, 256MX8, 0.45ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 | SK Hynix Inc | H5PS2G83MFP-Y5 vs H5PS2G83MFP-S5 |