Datasheets
HI1837C-Y-000 by: Hughes Aircraft

MASK ROM, 4KX8, 1375ns, CMOS, CDIP24

Part Details for HI1837C-Y-000 by Hughes Aircraft

Overview of HI1837C-Y-000 by Hughes Aircraft

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Applications Education and Research Environmental Monitoring Industrial Automation Agriculture Technology Medical Imaging Electronic Manufacturing

Part Details for HI1837C-Y-000

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HI1837C-Y-000 Part Data Attributes

HI1837C-Y-000 Hughes Aircraft
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HI1837C-Y-000 Hughes Aircraft MASK ROM, 4KX8, 1375ns, CMOS, CDIP24
Part Life Cycle Code Obsolete
Ihs Manufacturer HUGHES AIRCRAFT
Package Description ,
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 120 ns
JESD-30 Code R-GDIP-T24
Memory Density 65536 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 4096 words
Number of Words Code 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.052 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for HI1837C-Y-000

This table gives cross-reference parts and alternative options found for HI1837C-Y-000. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HI1837C-Y-000, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HB1837C-Y-000 MASK ROM, 4KX8, 1375ns, CMOS, CDIP24 Hughes Aircraft HI1837C-Y-000 vs HB1837C-Y-000
HI23C32C-Y-000 MASK ROM, 4KX8, 1375ns, CMOS, CDIP24 Hughes Aircraft HI1837C-Y-000 vs HI23C32C-Y-000
H23C32CP MASK ROM, 4KX8, 1375ns, CMOS, PDIP24 Hughes Aircraft HI1837C-Y-000 vs H23C32CP
Part Number Description Manufacturer Compare
AM2732B-205DC UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD HI1837C-Y-000 vs AM2732B-205DC
5962-9065801JX UVPROM, 4KX8, 70ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc HI1837C-Y-000 vs 5962-9065801JX
LD2732A-2 UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 Intel Corporation HI1837C-Y-000 vs LD2732A-2
AM2732B-205DI UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD HI1837C-Y-000 vs AM2732B-205DI
WS57C43B-70D UVPROM, 4KX8, 70ns, CMOS, CDIP24, Waferscale Integration Inc HI1837C-Y-000 vs WS57C43B-70D
WS57C43C-25D 4KX8 UVPROM, 25ns, CDIP24, 0.600 INCH, CERDIP-24 STMicroelectronics HI1837C-Y-000 vs WS57C43C-25D
PQ36C32-55 EEPROM, 4KX8, 55ns, Parallel, CMOS, PDIP24 LSI Corporation HI1837C-Y-000 vs PQ36C32-55
5962-9065804JX UVPROM, 4KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc HI1837C-Y-000 vs 5962-9065804JX
MD2732A-25 UVPROM, 4KX8, 250ns, CMOS, CDIP24, CERAMIC, DIP-24 Intel Corporation HI1837C-Y-000 vs MD2732A-25
WS57C43C-45TMB 4KX8 UVPROM, 45ns, CDIP24, 0.300 INCH, CERDIP-24 STMicroelectronics HI1837C-Y-000 vs WS57C43C-45TMB

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