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HM3-7603-5 by:

HM3-7603-5

Part Details for HM3-7603-5 by Intersil Corporation

Overview of HM3-7603-5 by Intersil Corporation

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Part Details for HM3-7603-5

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HM3-7603-5 Part Data Attributes

HM3-7603-5 Intersil Corporation
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HM3-7603-5 Intersil Corporation HM3-7603-5
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTERSIL CORP
Package Description DIP, DIP16,.3
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 50 ns
JESD-30 Code R-PDIP-T16
JESD-609 Code e0
Memory Density 256 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 16
Number of Words 32 words
Number of Words Code 32
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32X8
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.13 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology TTL
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

Alternate Parts for HM3-7603-5

This table gives cross-reference parts and alternative options found for HM3-7603-5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM3-7603-5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27S19DCB OTP ROM, 32X8, 40ns, Bipolar, CDIP16, CERAMIC, DIP-16 AMD HM3-7603-5 vs AM27S19DCB
N82S23NB 32X8 OTPROM, 50ns, PDIP16 Philips Semiconductors HM3-7603-5 vs N82S23NB
AM27S19ADCB OTP ROM, 32X8, 25ns, Bipolar, CDIP16, CERAMIC, DIP-16 AMD HM3-7603-5 vs AM27S19ADCB
N82S23ANB OTP ROM, 32X8, 25ns, Bipolar, PDIP16, Signetics HM3-7603-5 vs N82S23ANB
63S081AJXXXX OTP ROM, 32X8, 15ns, CMOS, CDIP16, Monolithic Memories (RETIRED) HM3-7603-5 vs 63S081AJXXXX
63S081AJ OTP ROM, 32X8, 15ns, CMOS, CDIP16, Monolithic Memories (RETIRED) HM3-7603-5 vs 63S081AJ
M38510/20702BEA 32X8 OTPROM, 80ns, DIP16, 0.25 X 0.875 INCH, DIP-16 Texas Instruments HM3-7603-5 vs M38510/20702BEA
AM27S19SADCB OTP ROM, 32X8, 15ns, Bipolar, CDIP16, CERAMIC, DIP-16 AMD HM3-7603-5 vs AM27S19SADCB
IDM29751NC IC 32 X 8 OTPROM, 30 ns, PDIP16, PLASTIC, DIP-16, Programmable ROM National Semiconductor Corporation HM3-7603-5 vs IDM29751NC
DM54S188AJ IC 32 X 8 OTPROM, 35 ns, CDIP16, CERAMIC, DIP-16, Programmable ROM National Semiconductor Corporation HM3-7603-5 vs DM54S188AJ

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