Part Details for HMC448 by Analog Devices Inc
Results Overview of HMC448 by Analog Devices Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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HMC448 Information
HMC448 by Analog Devices Inc is an RF/Microwave Frequency Multiplier.
RF/Microwave Frequency Multipliers are under the broader part category of RF and Microwave Components.
RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.
Price & Stock for HMC448
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
505-HMC448-ND
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DigiKey | IC MULTIPLIER BB DIE Lead time: 10 Weeks Container: Tray | Limited Supply - Call |
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Buy Now | |
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Analog Devices Inc | x2 Active mult Chip, 19 - 25 G Package Multiple: 50 | 0 |
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$50.5600 / $64.7900 | Buy Now |
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DISTI #
HMC448
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Richardson RFPD | FREQUENCY MULTIPLIER RoHS: Compliant Min Qty: 1 | 0 |
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RFQ |
US Tariff Estimator: HMC448 by Analog Devices Inc
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for HMC448
HMC448 Part Data Attributes
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HMC448
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
HMC448
Analog Devices Inc
Frequency Doubler, 19000MHz Min, 25000MHz Max
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Package Description | 1.20 X 1.16 Mm, 0.10 Mm Height, Die-4 | |
| Pin Count | 0 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Characteristic Impedance | 50 Ω | |
| Construction | Component | |
| Input Power-Max (CW) | 20 Dbm | |
| JESD-609 Code | e4 | |
| Mounting Feature | Surface Mount | |
| Number of Terminals | 4 | |
| Operating Frequency-Max | 25000 Mhz | |
| Operating Frequency-Min | 19000 Mhz | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -55 °C | |
| RF/Microwave Device Type | Frequency Doubler | |
| Surface Mount | Yes | |
| Terminal Finish | Gold (Au) |
HMC448 Frequently Asked Questions (FAQ)
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A good PCB layout for the HMC448 involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing bypass capacitors close to the device. For thermal management, ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to dissipate high power.
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To optimize the HMC448's performance, consider the specific requirements of your application, such as frequency range, power level, and impedance matching. Use simulation tools and/or empirical methods to optimize the device's performance, and consider consulting with an RF engineer or Analog Devices' application support team if needed.
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Potential sources of noise and interference in the HMC448 include electromagnetic interference (EMI), radio-frequency interference (RFI), and thermal noise. To mitigate these, use proper shielding, grounding, and filtering, and consider using noise-reducing components such as ferrite beads or common-mode chokes.
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To ensure the HMC448's reliability and longevity in harsh environments, follow proper handling and storage procedures, use a robust PCB design, and consider using conformal coating or potting to protect the device from moisture and contaminants.
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The HMC448's operating modes (e.g., low-power, high-power, and bypass modes) offer trade-offs between power consumption, noise figure, and gain. Choose the best mode for your application by considering factors such as power budget, noise requirements, and signal strength, and consult the datasheet and application notes for guidance.