Datasheets
HMC448 by:
Analog Devices Inc

Frequency Doubler, 19000MHz Min, 25000MHz Max

Part Details for HMC448 by Analog Devices Inc

Results Overview of HMC448 by Analog Devices Inc

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Applications Consumer Electronics Audio and Video Systems

HMC448 Information

HMC448 by Analog Devices Inc is an RF/Microwave Frequency Multiplier.
RF/Microwave Frequency Multipliers are under the broader part category of RF and Microwave Components.

RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.

Price & Stock for HMC448

Part # Distributor Description Stock Price Buy
DISTI # 505-HMC448-ND
DigiKey IC MULTIPLIER BB DIE Lead time: 10 Weeks Container: Tray Limited Supply - Call
Buy Now
Analog Devices Inc x2 Active mult Chip, 19 - 25 G Package Multiple: 50 0
  • 1 $64.7900
  • 1,000 $50.5600
$50.5600 / $64.7900 Buy Now
DISTI # HMC448
Richardson RFPD FREQUENCY MULTIPLIER RoHS: Compliant Min Qty: 1 0
RFQ

US Tariff Estimator: HMC448 by Analog Devices Inc

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HMC448
Analog Devices Inc
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Part Details for HMC448

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HMC448 Part Data Attributes

HMC448 Analog Devices Inc
Buy Now Datasheet
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HMC448 Analog Devices Inc Frequency Doubler, 19000MHz Min, 25000MHz Max
Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active
Package Description 1.20 X 1.16 Mm, 0.10 Mm Height, Die-4
Pin Count 0
Reach Compliance Code Compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Characteristic Impedance 50 Ω
Construction Component
Input Power-Max (CW) 20 Dbm
JESD-609 Code e4
Mounting Feature Surface Mount
Number of Terminals 4
Operating Frequency-Max 25000 Mhz
Operating Frequency-Min 19000 Mhz
Operating Temperature-Max 85 °C
Operating Temperature-Min -55 °C
RF/Microwave Device Type Frequency Doubler
Surface Mount Yes
Terminal Finish Gold (Au)
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HMC448 Related Parts

HMC448 Frequently Asked Questions (FAQ)

  • A good PCB layout for the HMC448 involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing bypass capacitors close to the device. For thermal management, ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to dissipate high power.

  • To optimize the HMC448's performance, consider the specific requirements of your application, such as frequency range, power level, and impedance matching. Use simulation tools and/or empirical methods to optimize the device's performance, and consider consulting with an RF engineer or Analog Devices' application support team if needed.

  • Potential sources of noise and interference in the HMC448 include electromagnetic interference (EMI), radio-frequency interference (RFI), and thermal noise. To mitigate these, use proper shielding, grounding, and filtering, and consider using noise-reducing components such as ferrite beads or common-mode chokes.

  • To ensure the HMC448's reliability and longevity in harsh environments, follow proper handling and storage procedures, use a robust PCB design, and consider using conformal coating or potting to protect the device from moisture and contaminants.

  • The HMC448's operating modes (e.g., low-power, high-power, and bypass modes) offer trade-offs between power consumption, noise figure, and gain. Choose the best mode for your application by considering factors such as power budget, noise requirements, and signal strength, and consult the datasheet and application notes for guidance.

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