There are no models available for this part yet.
Overview of HN27512G-30 by Renesas Electronics Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
CAD Models for HN27512G-30 by Renesas Electronics Corporation
Part Data Attributes for HN27512G-30 by Renesas Electronics Corporation
|
|
|
|---|---|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
RENESAS TECHNOLOGY CORP
|
|
Part Package Code
|
DIP
|
|
Package Description
|
WDIP,
|
|
Pin Count
|
28
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.61
|
|
Access Time-Max
|
300 ns
|
|
JESD-30 Code
|
R-GDIP-T28
|
|
Length
|
36.83 mm
|
|
Memory Density
|
524288 bit
|
|
Memory IC Type
|
UVPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
28
|
|
Number of Words
|
65536 words
|
|
Number of Words Code
|
64000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
64KX8
|
|
Package Body Material
|
CERAMIC, GLASS-SEALED
|
|
Package Code
|
WDIP
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE, WINDOW
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.89 mm
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
15.24 mm
|
Alternate Parts for HN27512G-30
This table gives cross-reference parts and alternative options found for HN27512G-30. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN27512G-30, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBM27C512-30WZ | UVPROM, 64KX8, 300ns, CMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | HN27512G-30 vs MBM27C512-30WZ |
| AM27512-30DI | UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | HN27512G-30 vs AM27512-30DI |
| AM27C512-305DIB | UVPROM, 64KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | HN27512G-30 vs AM27C512-305DIB |
| MBM27C512-30WZ | 64KX8 UVPROM, 300ns, CDIP28, CERDIP-28 | FUJITSU Limited | HN27512G-30 vs MBM27C512-30WZ |
| AM27C512-305DI | UVPROM, 64KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | HN27512G-30 vs AM27C512-305DI |
| M27512-3F1 | 64KX8 UVPROM, 300ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 | STMicroelectronics | HN27512G-30 vs M27512-3F1 |
| AM27512-3DC | UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | HN27512G-30 vs AM27512-3DC |
| AM27C512-300DCB | UVPROM, 64KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | HN27512G-30 vs AM27C512-300DCB |
| AM27512-30DCB | UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | HN27512G-30 vs AM27512-30DCB |
| TMS27C512-3JL4 | 64KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | HN27512G-30 vs TMS27C512-3JL4 |