There are no models available for this part yet.
Overview of HN27C256G-20 by Renesas Electronics Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
CAD Models for HN27C256G-20 by Renesas Electronics Corporation
Part Data Attributes for HN27C256G-20 by Renesas Electronics Corporation
|
|
|
|---|---|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
RENESAS TECHNOLOGY CORP
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|
Part Package Code
|
DIP
|
|
Package Description
|
WDIP,
|
|
Pin Count
|
28
|
|
Reach Compliance Code
|
unknown
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|
ECCN Code
|
EAR99
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|
HTS Code
|
8542.32.00.61
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|
Access Time-Max
|
200 ns
|
|
JESD-30 Code
|
R-GDIP-T28
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Length
|
36.83 mm
|
|
Memory Density
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262144 bit
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Memory IC Type
|
UVPROM
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Memory Width
|
8
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Number of Functions
|
1
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Number of Terminals
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28
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Number of Words
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32768 words
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Number of Words Code
|
32000
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Operating Mode
|
ASYNCHRONOUS
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|
Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
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|
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Organization
|
32KX8
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Package Body Material
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CERAMIC, GLASS-SEALED
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Package Code
|
WDIP
|
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE, WINDOW
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|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.89 mm
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|
Supply Current-Max
|
0.03 mA
|
|
Supply Voltage-Max (Vsup)
|
5.25 V
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|
Supply Voltage-Min (Vsup)
|
4.75 V
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Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
|
NO
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Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
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Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
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|
Width
|
15.24 mm
|
Alternate Parts for HN27C256G-20
This table gives cross-reference parts and alternative options found for HN27C256G-20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN27C256G-20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NM27C256QE200 | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | Texas Instruments | HN27C256G-20 vs NM27C256QE200 |
| TMS27C256-2JE | 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 | Texas Instruments | HN27C256G-20 vs TMS27C256-2JE |
| NMC27C256QE200 | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | HN27C256G-20 vs NMC27C256QE200 |
| AM27C256-205DC | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | HN27C256G-20 vs AM27C256-205DC |
| M27C256B-20XF7 | 32KX8 UVPROM, 200ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | HN27C256G-20 vs M27C256B-20XF7 |
| AM27C256-200DEB | UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 | Spansion | HN27C256G-20 vs AM27C256-200DEB |
| AM27C256-200DIB | UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 | Spansion | HN27C256G-20 vs AM27C256-200DIB |
| TMS27C256-20JE4 | 32KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | HN27C256G-20 vs TMS27C256-20JE4 |
| TMS27C256-20JE | 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 | Texas Instruments | HN27C256G-20 vs TMS27C256-20JE |
| CY27C256A-200WMB | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 | Rochester Electronics LLC | HN27C256G-20 vs CY27C256A-200WMB |