There are no models available for this part yet.
Overview of HY27SG162G2M-TPES by SK Hynix Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 89KTPES48H12 | Renesas Electronics Corporation | System Development Kit for the PES48H12 PCI Express System Interconnect Switch | |
| 89KTPES16T4G2 | Renesas Electronics Corporation | Evaluation Board SDK for the 89HPES16T4G2 | |
| 89KTPES24T6 | Renesas Electronics Corporation | System Development Kit for the PES24T6 PCI Express I/O Expansion Switch |
CAD Models for HY27SG162G2M-TPES by SK Hynix Inc
Part Data Attributes for HY27SG162G2M-TPES by SK Hynix Inc
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
SK HYNIX INC
|
|
Part Package Code
|
TSOP1
|
|
Package Description
|
TSOP1, TSSOP48,.8,20
|
|
Pin Count
|
48
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.51
|
|
Access Time-Max
|
30 ns
|
|
Command User Interface
|
YES
|
|
Data Polling
|
NO
|
|
JESD-30 Code
|
R-PDSO-G48
|
|
JESD-609 Code
|
e6
|
|
Length
|
18.4 mm
|
|
Memory Density
|
2147483648 bit
|
|
Memory IC Type
|
FLASH
|
|
Memory Width
|
16
|
|
Number of Functions
|
1
|
|
Number of Sectors/Size
|
2K
|
|
Number of Terminals
|
48
|
|
Number of Words
|
134217728 words
|
|
Number of Words Code
|
128000000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-25 °C
|
|
Organization
|
128MX16
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TSOP1
|
|
Package Equivalence Code
|
TSSOP48,.8,20
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
SMALL OUTLINE, THIN PROFILE
|
|
Page Size
|
1K words
|
|
Parallel/Serial
|
PARALLEL
|
|
Programming Voltage
|
1.8 V
|
|
Qualification Status
|
Not Qualified
|
|
Ready/Busy
|
YES
|
|
Seated Height-Max
|
1.2 mm
|
|
Sector Size
|
64K
|
|
Standby Current-Max
|
0.0001 A
|
|
Supply Current-Max
|
0.02 mA
|
|
Supply Voltage-Max (Vsup)
|
1.95 V
|
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
OTHER
|
|
Terminal Finish
|
TIN BISMUTH
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
0.5 mm
|
|
Terminal Position
|
DUAL
|
|
Toggle Bit
|
NO
|
|
Type
|
SLC NAND TYPE
|
|
Width
|
12 mm
|
Alternate Parts for HY27SG162G2M-TPES
This table gives cross-reference parts and alternative options found for HY27SG162G2M-TPES. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY27SG162G2M-TPES, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HY27SG162G2M-TCB | Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48 | SK Hynix Inc | HY27SG162G2M-TPES vs HY27SG162G2M-TCB |
| MT29F2G16BBCWPET:C | Flash, 128MX16, 30ns, PDSO48, LEAD FREE, PLASTIC, TSOP1-48 | Micron Technology Inc | HY27SG162G2M-TPES vs MT29F2G16BBCWPET:C |
| HY27SG162G2M-TEB | Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48 | SK Hynix Inc | HY27SG162G2M-TPES vs HY27SG162G2M-TEB |
| HY27SG162G2M-TPCS | Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48 | SK Hynix Inc | HY27SG162G2M-TPES vs HY27SG162G2M-TPCS |
| HY27SG162G2M-TPIP | Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48 | SK Hynix Inc | HY27SG162G2M-TPES vs HY27SG162G2M-TPIP |
| HY27SG162G2M-TIS | Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48 | SK Hynix Inc | HY27SG162G2M-TPES vs HY27SG162G2M-TIS |
| HY27SG162G2M-TPCB | Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48 | SK Hynix Inc | HY27SG162G2M-TPES vs HY27SG162G2M-TPCB |
| HY27SG162G2M-TEP | Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48 | SK Hynix Inc | HY27SG162G2M-TPES vs HY27SG162G2M-TEP |
| HY27SG162G2M-TPIS | Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48 | SK Hynix Inc | HY27SG162G2M-TPES vs HY27SG162G2M-TPIS |
| MT29F2G16FBCWP:C | Flash, 128MX16, 30ns, PDSO48, LEAD FREE, PLASTIC, TSOP1-48 | Micron Technology Inc | HY27SG162G2M-TPES vs MT29F2G16FBCWP:C |