Datasheets
HY5DS283222BF-33 by: SK Hynix Inc

DDR DRAM, 4MX32, 0.6ns, CMOS, PBGA144, 12 X 12 MM, FBGA-144

Part Details for HY5DS283222BF-33 by SK Hynix Inc

Overview of HY5DS283222BF-33 by SK Hynix Inc

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Part Details for HY5DS283222BF-33

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HY5DS283222BF-33 Part Data Attributes:

HY5DS283222BF-33 SK Hynix Inc
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HY5DS283222BF-33 SK Hynix Inc DDR DRAM, 4MX32, 0.6ns, CMOS, PBGA144, 12 X 12 MM, FBGA-144
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code BGA
Package Description LFBGA, BGA144,12X12,32
Pin Count 144
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.6 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 303 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code S-PBGA-B144
JESD-609 Code e0
Length 12 mm
Memory Density 134217728 bit
Memory IC Type DDR1 DRAM
Memory Width 32
Number of Functions 1
Number of Ports 1
Number of Terminals 144
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 4MX32
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA144,12X12,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified
Refresh Cycles 4096
Seated Height-Max 1.21 mm
Self Refresh YES
Sequential Burst Length 2,4,8
Standby Current-Max 0.025 A
Supply Current-Max 0.35 mA
Supply Voltage-Max (Vsup) 2.1 V
Supply Voltage-Min (Vsup) 1.75 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 12 mm

Alternate Parts for HY5DS283222BF-33

This table gives cross-reference parts and alternative options found for HY5DS283222BF-33. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY5DS283222BF-33, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HY5DS283222BFP-33 DDR DRAM, 4MX32, 0.6ns, CMOS, PBGA144, 12 X 12 MM, LEAD FREE, FBGA-144 SK Hynix Inc HY5DS283222BF-33 vs HY5DS283222BFP-33
Part Number Description Manufacturer Compare
MT46V4M32FK-45 DDR DRAM, 4MX32, 0.7ns, CMOS, PBGA144, 12 X 12 MM, PLASTIC, FBGA-144 Micron Technology Inc HY5DS283222BF-33 vs MT46V4M32FK-45
HY5DU283222AF-25 DDR DRAM, 4MX32, 0.6ns, CMOS, PBGA144, 12 X 12 MM, 0.80 MM PITCH, FBGA-144 SK Hynix Inc HY5DS283222BF-33 vs HY5DU283222AF-25
NT5DU4M32EF-6 DDR DRAM, 4MX32, 0.75ns, CMOS, PBGA144, FBGA-144 Nanya Technology Corporation HY5DS283222BF-33 vs NT5DU4M32EF-6
K4D263238K-VC40T DDR DRAM, 4MX32, 0.6ns, CMOS, PBGA144, LEAD FREE, FBGA-144 Samsung Semiconductor HY5DS283222BF-33 vs K4D263238K-VC40T
K4D263238E-GC36 DDR DRAM, 4MX32, 0.6ns, CMOS, PBGA144, FBGA-144 Samsung Semiconductor HY5DS283222BF-33 vs K4D263238E-GC36
HY5DU283222AFP-36 DDR DRAM, 4MX32, 0.6ns, CMOS, PBGA144, 12 X 12 MM, 0.80 MM PITCH, LEAD FREE, FBGA-144 SK Hynix Inc HY5DS283222BF-33 vs HY5DU283222AFP-36
HY5DU283222AFP-5 DDR DRAM, 4MX32, 0.6ns, CMOS, PBGA144, 12 X 12 MM, 0.80 MM PITCH, LEAD FREE, FBGA-144 SK Hynix Inc HY5DS283222BF-33 vs HY5DU283222AFP-5
HY5DU283222F-28 DDR DRAM, 4MX32, 0.9ns, CMOS, PBGA144, 12 X 12 MM, 0.80 MM PITCH, FBGA-144 SK Hynix Inc HY5DS283222BF-33 vs HY5DU283222F-28
HY5DU283222AF-22 DDR DRAM, 4MX32, 0.45ns, CMOS, PBGA144, 12 X 12 MM, 0.80 MM PITCH, FBGA-144 SK Hynix Inc HY5DS283222BF-33 vs HY5DU283222AF-22
HY5DW283222AF-28 DDR DRAM, 4MX32, 0.6ns, CMOS, PBGA144, 12 X 12 MM, 0.80 MM PITCH, FBGA-144 SK Hynix Inc HY5DS283222BF-33 vs HY5DW283222AF-28

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