Datasheets
HY5DU56822CTP-M by: SK Hynix Inc

DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66

Part Details for HY5DU56822CTP-M by SK Hynix Inc

Overview of HY5DU56822CTP-M by SK Hynix Inc

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Applications Consumer Electronics Computing and Data Storage

Part Details for HY5DU56822CTP-M

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HY5DU56822CTP-M Part Data Attributes

HY5DU56822CTP-M SK Hynix Inc
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HY5DU56822CTP-M SK Hynix Inc DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code TSOP2
Package Description TSOP2, TSSOP66,.46
Pin Count 66
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.24
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.75 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code R-PDSO-G66
JESD-609 Code e6
Length 22.225 mm
Memory Density 268435456 bit
Memory IC Type DDR1 DRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 66
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Equivalence Code TSSOP66,.46
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.194 mm
Self Refresh YES
Sequential Burst Length 2,4,8
Standby Current-Max 0.01 A
Supply Current-Max 0.27 mA
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Bismuth (Sn/Bi)
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 10.16 mm

Alternate Parts for HY5DU56822CTP-M

This table gives cross-reference parts and alternative options found for HY5DU56822CTP-M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY5DU56822CTP-M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HY5DU56822CT-M DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 SK Hynix Inc HY5DU56822CTP-M vs HY5DU56822CT-M
HY5DU56822DT-K DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 SK Hynix Inc HY5DU56822CTP-M vs HY5DU56822DT-K
HY5DU56822ETP-K DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc HY5DU56822CTP-M vs HY5DU56822ETP-K
HY5DU56822CLT-K DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 SK Hynix Inc HY5DU56822CTP-M vs HY5DU56822CLT-K
HY5DU56822ELTP-K DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc HY5DU56822CTP-M vs HY5DU56822ELTP-K
HY5DU56822DLT-H DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 SK Hynix Inc HY5DU56822CTP-M vs HY5DU56822DLT-H
HY5DU56822CLT-M DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 SK Hynix Inc HY5DU56822CTP-M vs HY5DU56822CLT-M
HY5DU56822ETP-H DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc HY5DU56822CTP-M vs HY5DU56822ETP-H
HY5DU56822DLTP-H DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc HY5DU56822CTP-M vs HY5DU56822DLTP-H
HY5DU56822CTP-H DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 SK Hynix Inc HY5DU56822CTP-M vs HY5DU56822CTP-H
Part Number Description Manufacturer Compare
MT46V32M8P-75ZIT DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822CTP-M vs MT46V32M8P-75ZIT
K4H560838E-TCB00 DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Samsung Semiconductor HY5DU56822CTP-M vs K4H560838E-TCB00
MT46V32M8TC-5B:G DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822CTP-M vs MT46V32M8TC-5B:G
IBMN625805GT3B-75N DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66 IBM HY5DU56822CTP-M vs IBMN625805GT3B-75N
MT46V32M8BJ-75ZLIT DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, 16 X 9 MM, PLASTIC, FBGA-60 Micron Technology Inc HY5DU56822CTP-M vs MT46V32M8BJ-75ZLIT
MT46V32M8FG-75ZLIT:C DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, 8 X 14 MM, PLASTIC, FBGA-60 Micron Technology Inc HY5DU56822CTP-M vs MT46V32M8FG-75ZLIT:C
V58C2256804SBT7 DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, PLASTIC, TSOP2-66 Mosel Vitelic Corporation HY5DU56822CTP-M vs V58C2256804SBT7
MT46V32M8P-75L:C DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822CTP-M vs MT46V32M8P-75L:C
HY5DU56822AF-M DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, FBGA-60 SK Hynix Inc HY5DU56822CTP-M vs HY5DU56822AF-M
MT46V32M8TG-75ZH DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822CTP-M vs MT46V32M8TG-75ZH

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