Part Details for HY62CT08081E-DP70C by SK Hynix Inc
Overview of HY62CT08081E-DP70C by SK Hynix Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (4 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for HY62CT08081E-DP70C
HY62CT08081E-DP70C CAD Models
HY62CT08081E-DP70C Part Data Attributes:
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HY62CT08081E-DP70C
SK Hynix Inc
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Datasheet
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HY62CT08081E-DP70C
SK Hynix Inc
Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SK HYNIX INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP28,.6 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 70 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.826 mm | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for HY62CT08081E-DP70C
This table gives cross-reference parts and alternative options found for HY62CT08081E-DP70C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY62CT08081E-DP70C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W24256-70L | Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Winbond Electronics Corp | HY62CT08081E-DP70C vs W24256-70L |
| K6T0808C1D-DL70 | Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, DIP-28 | Samsung Semiconductor | HY62CT08081E-DP70C vs K6T0808C1D-DL70 |
| W24258-70LL | Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Winbond Electronics Corp | HY62CT08081E-DP70C vs W24258-70LL |
| K6T0808C1D-DB70 | Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, DIP-28 | Samsung Semiconductor | HY62CT08081E-DP70C vs K6T0808C1D-DB70 |