Part Details for K6T0808C1D-DB70 by Samsung Semiconductor
Overview of K6T0808C1D-DB70 by Samsung Semiconductor
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (3 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Price & Stock for K6T0808C1D-DB70
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | Min Qty: 1 | 898 |
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$6.0375 / $10.5000 | Buy Now |
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Quest Components | Static RAM, 32Kx8, 28 Pin, Plastic, DIP | 10 |
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$4.1580 / $5.6700 | Buy Now |
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Quest Components | Static RAM, 32Kx8, 28 Pin, Plastic, DIP | 708 |
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$7.3500 / $14.0000 | Buy Now |
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Quest Components | Static RAM, 32Kx8, 28 Pin, Plastic, DIP | 23 |
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$16.6045 / $20.1947 | Buy Now |
Part Details for K6T0808C1D-DB70
K6T0808C1D-DB70 CAD Models
K6T0808C1D-DB70 Part Data Attributes
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K6T0808C1D-DB70
Samsung Semiconductor
Buy Now
Datasheet
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Compare Parts:
K6T0808C1D-DB70
Samsung Semiconductor
Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, DIP-28
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Part Package Code | DIP | |
Package Description | 0.600 INCH, DIP-28 | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 70 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PDIP-T28 | |
Length | 36.32 mm | |
Memory Density | 262144 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.06 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for K6T0808C1D-DB70
This table gives cross-reference parts and alternative options found for K6T0808C1D-DB70. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K6T0808C1D-DB70, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
HY62CT08081E-DP70C | Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | SK Hynix Inc | K6T0808C1D-DB70 vs HY62CT08081E-DP70C |
K6T0808C1D-DL70 | Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, DIP-28 | Samsung Semiconductor | K6T0808C1D-DB70 vs K6T0808C1D-DL70 |
W24258-70LL | Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Winbond Electronics Corp | K6T0808C1D-DB70 vs W24258-70LL |