There are no models available for this part yet.
Overview of HYB18T256160AC-3 by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 8 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for HYB18T256160AC-3 by Infineon Technologies AG
Part Data Attributes for HYB18T256160AC-3 by Infineon Technologies AG
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|
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|---|---|
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Rohs Code
|
No
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|
Part Life Cycle Code
|
Obsolete
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Ihs Manufacturer
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INFINEON TECHNOLOGIES AG
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Part Package Code
|
DSBGA
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Package Description
|
FBGA,
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Pin Count
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84
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Reach Compliance Code
|
compliant
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ECCN Code
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EAR99
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HTS Code
|
8542.32.00.24
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Access Mode
|
FOUR BANK PAGE BURST
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Access Time-Max
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0.45 ns
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Additional Feature
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AUTO/SELF REFRESH
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JESD-30 Code
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R-PBGA-B84
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Length
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12.5 mm
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Memory Density
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268435456 bit
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Memory IC Type
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DDR DRAM
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Memory Width
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16
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Number of Functions
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1
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Number of Ports
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1
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Number of Terminals
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84
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Number of Words
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16777216 words
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Number of Words Code
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16000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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95 °C
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Operating Temperature-Min
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|
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Organization
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16MX16
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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FBGA
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, FINE PITCH
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Peak Reflow Temperature (Cel)
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NOT SPECIFIED
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Qualification Status
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Not Qualified
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Self Refresh
|
YES
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Supply Voltage-Max (Vsup)
|
1.9 V
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Supply Voltage-Min (Vsup)
|
1.7 V
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Supply Voltage-Nom (Vsup)
|
1.8 V
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Surface Mount
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YES
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Technology
|
CMOS
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Temperature Grade
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OTHER
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Terminal Form
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BALL
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Terminal Pitch
|
0.8 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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NOT SPECIFIED
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Width
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10 mm
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Alternate Parts for HYB18T256160AC-3
This table gives cross-reference parts and alternative options found for HYB18T256160AC-3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYB18T256160AC-3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| V59C1256164QALS-3 | DDR DRAM, 16MX16, 0.45ns, CMOS, PBGA84, MO-207, FBGA-84 | ProMOS Technologies Inc | HYB18T256160AC-3 vs V59C1256164QALS-3 |
| EDE2516ACBG-6E-E | DDR DRAM, 16MX16, 0.45ns, CMOS, PBGA84, ROHS COMPLIANT, FBGA-84 | Elpida Memory Inc | HYB18T256160AC-3 vs EDE2516ACBG-6E-E |
| HYB18T256160AC-3S | DDR DRAM, 16MX16, 0.45ns, CMOS, PBGA84, 12.50 X 10 MM, MO-207DK-Z, FBGA-84 | Infineon Technologies AG | HYB18T256160AC-3 vs HYB18T256160AC-3S |
| EDE2516ACSE-6C-E | DDR DRAM, 16MX16, 0.45ns, CMOS, PBGA84, ROHS COMPLIANT, FBGA-84 | Elpida Memory Inc | HYB18T256160AC-3 vs EDE2516ACSE-6C-E |
| V59C1256164QAF-3 | DDR DRAM, 16MX16, 0.45ns, CMOS, PBGA84, ROHS COMPLIANT, MO-207, FBGA-84 | ProMOS Technologies Inc | HYB18T256160AC-3 vs V59C1256164QAF-3 |
| EDE2516ACBG-6C-E | DDR DRAM, 16MX16, 0.45ns, CMOS, PBGA84, ROHS COMPLIANT, FBGA-84 | Elpida Memory Inc | HYB18T256160AC-3 vs EDE2516ACBG-6C-E |
| HYB18TC256160AF-3S | DDR DRAM, 16MX16, 0.45ns, CMOS, PBGA84, GREEN, PLASTIC, TFBGA-84 | Infineon Technologies AG | HYB18T256160AC-3 vs HYB18TC256160AF-3S |
| HYB18T256161BF-20 | DDR DRAM, 16MX16, 0.45ns, CMOS, PBGA84, GREEN, PLASTIC, TFBGA-84 | Qimonda AG | HYB18T256160AC-3 vs HYB18T256161BF-20 |