Datasheets
HYB25DC128160CF-6 by:

DDR DRAM, 8MX16, 0.7ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60

Part Details for HYB25DC128160CF-6 by Infineon Technologies AG

Overview of HYB25DC128160CF-6 by Infineon Technologies AG

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Part Details for HYB25DC128160CF-6

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HYB25DC128160CF-6 Part Data Attributes

HYB25DC128160CF-6 Infineon Technologies AG
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HYB25DC128160CF-6 Infineon Technologies AG DDR DRAM, 8MX16, 0.7ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60
Part Life Cycle Code Transferred
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Part Package Code BGA
Package Description TBGA,
Pin Count 60
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.7 ns
Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B60
Length 12 mm
Memory Density 134217728 bit
Memory IC Type DDR DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 60
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 8MX16
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 8 mm

Alternate Parts for HYB25DC128160CF-6

This table gives cross-reference parts and alternative options found for HYB25DC128160CF-6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYB25DC128160CF-6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HYB25DC128160CF-6 DDR DRAM, 8MX16, 0.7ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 Qimonda AG HYB25DC128160CF-6 vs HYB25DC128160CF-6
Part Number Description Manufacturer Compare
V54C3256164VDUF6I Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA60, ROHS COMPLIANT, MO-210, FBGA-60 ProMOS Technologies Inc HYB25DC128160CF-6 vs V54C3256164VDUF6I
MT46V16M16FG-6IT DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 8 X 14 MM, PLASTIC, FBGA-60 Micron Technology Inc HYB25DC128160CF-6 vs MT46V16M16FG-6IT
V58C2256164SALS-7 DDR DRAM, 16MX16, 0.75ns, CMOS, PBGA60, MO-233, FBGA-60 ProMOS Technologies Inc HYB25DC128160CF-6 vs V58C2256164SALS-7
MT46V16M16FJ-75 DDR DRAM, 16MX16, 0.75ns, CMOS, PBGA60, 16 X 9 MM, PLASTIC, FBGA-60 Micron Technology Inc HYB25DC128160CF-6 vs MT46V16M16FJ-75
K4H561638F-GCC40 DDR DRAM, 16MX16, 0.65ns, CMOS, PBGA60, FBGA-60 Samsung Semiconductor HYB25DC128160CF-6 vs K4H561638F-GCC40
MT46V16M16FJ-75L DDR DRAM, 16MX16, 0.75ns, CMOS, PBGA60, 16 X 9 MM, PLASTIC, FBGA-60 Micron Technology Inc HYB25DC128160CF-6 vs MT46V16M16FJ-75L
MT46V16M16CY-6:K DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, (8 X 12.5) MM, LEAD FREE, PLASTIC, FBGA-60 Micron Technology Inc HYB25DC128160CF-6 vs MT46V16M16CY-6:K
V59C1256164QILJ25I DDR DRAM, 16MX16, 0.4ns, CMOS, PBGA60, GREEN, MO-207, FBGA-60 ProMOS Technologies Inc HYB25DC128160CF-6 vs V59C1256164QILJ25I
V58C2256164SHLP4E DDR DRAM, 16MX16, CMOS, PBGA60, GREEN, MO-233, FBGA-60 ProMOS Technologies Inc HYB25DC128160CF-6 vs V58C2256164SHLP4E
NT5DS16M16CG-6KI DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 1 MM PITCH, GREEN, WBGA-60 Nanya Technology Corporation HYB25DC128160CF-6 vs NT5DS16M16CG-6KI

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