Datasheets
HYI18T256160BC-3.7 by: Qimonda AG

DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA84, PLASTIC, TFBGA-84

Part Details for HYI18T256160BC-3.7 by Qimonda AG

Overview of HYI18T256160BC-3.7 by Qimonda AG

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Part Details for HYI18T256160BC-3.7

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HYI18T256160BC-3.7 Part Data Attributes

HYI18T256160BC-3.7 Qimonda AG
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HYI18T256160BC-3.7 Qimonda AG DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA84, PLASTIC, TFBGA-84
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer QIMONDA AG
Part Package Code BGA
Package Description TFBGA, BGA84,9X15,32
Pin Count 84
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.24
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.5 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 266 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B84
Length 12.5 mm
Memory Density 268435456 bit
Memory IC Type DDR2 DRAM
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 1
Number of Terminals 84
Number of Words 16777216 words
Number of Words Code 16000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 16MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA84,9X15,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 4,8
Standby Current-Max 0.033 A
Supply Current-Max 0.135 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 10 mm

Alternate Parts for HYI18T256160BC-3.7

This table gives cross-reference parts and alternative options found for HYI18T256160BC-3.7. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYI18T256160BC-3.7, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HYB18T256160BC-2.5 DDR DRAM, 16MX16, 0.4ns, CMOS, PBGA84, PLASTIC, TFBGA-84 Qimonda AG HYI18T256160BC-3.7 vs HYB18T256160BC-2.5
H5PS2562GFR-G7I DDR DRAM, 16MX16, 0.35ns, CMOS, PBGA84, 7.50 X 12.50 MM, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84 SK Hynix Inc HYI18T256160BC-3.7 vs H5PS2562GFR-G7I
IS46DR16160A-5BBLA1 DDR DRAM, 16MX16, 0.6ns, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TWBGA-84 Integrated Silicon Solution Inc HYI18T256160BC-3.7 vs IS46DR16160A-5BBLA1
MT6V16M16F2-4D Rambus DRAM, 16MX16, CMOS, PBGA84, FBGA-84 Micron Technology Inc HYI18T256160BC-3.7 vs MT6V16M16F2-4D
V59C1256164QAS-5 DDR DRAM, 16MX16, 0.6ns, CMOS, PBGA84, MO-207, FBGA-84 ProMOS Technologies Inc HYI18T256160BC-3.7 vs V59C1256164QAS-5
MT47H16M16BG-5EAT:B DDR DRAM, 16MX16, 0.6ns, CMOS, PBGA84, 8 X 14 MM, ROHS COMPLIANT, FBGA-84 Micron Technology Inc HYI18T256160BC-3.7 vs MT47H16M16BG-5EAT:B
HY5PS561621AFP-25 DDR DRAM, 16MX16, 0.4ns, CMOS, PBGA84, LEAD FREE, FBGA-84 SK Hynix Inc HYI18T256160BC-3.7 vs HY5PS561621AFP-25
V59C1256164QALS-37 DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA84, MO-207, FBGA-84 ProMOS Technologies Inc HYI18T256160BC-3.7 vs V59C1256164QALS-37
HYB18T256160BF-3.7 DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA84, GREEN, PLASTIC, TFBGA-84 Qimonda AG HYI18T256160BC-3.7 vs HYB18T256160BF-3.7
IS46DR16160A-37CBLA1 DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TWBGA-84 Integrated Silicon Solution Inc HYI18T256160BC-3.7 vs IS46DR16160A-37CBLA1

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