Part Details for IS42RM16160K-6BLI by Integrated Silicon Solution Inc
Results Overview of IS42RM16160K-6BLI by Integrated Silicon Solution Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (1 option)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
IS42RM16160K-6BLI Information
IS42RM16160K-6BLI by Integrated Silicon Solution Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for IS42RM16160K-6BLI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
29X5147
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Newark | 256M, 2.5V, Mobile Sdram, 16Mx16, 166Mhz, 54 Ball Bga (8Mm X 8Mm) Rohs, It |Integrated Silicon Solution/issi IS42RM16160K-6BLI RoHS: Not Compliant Min Qty: 348 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$4.2200 / $4.3400 | Buy Now |
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DISTI #
IS42RM16160K-6BLI
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Avnet Americas | DRAM Chip Mobile SDRAM 256M-Bit 16M x 16 2.5V 54-Pin TFBGA - Bulk (Alt: IS42RM16160K-6BLI) COO: Taiwan (Province of China) RoHS: Compliant Min Qty: 348 Package Multiple: 348 Lead time: 8 Weeks, 0 Days Container: Bulk | 0 |
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$4.6948 / $4.8411 | Buy Now |
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DISTI #
IS42RM16160K-6BLI
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Avnet Silica | DRAM Chip Mobile SDRAM 256MBit 16M x 16 25V 54Pin TFBGA (Alt: IS42RM16160K-6BLI) RoHS: Compliant Min Qty: 348 Package Multiple: 348 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now |
US Tariff Estimator: IS42RM16160K-6BLI by Integrated Silicon Solution Inc
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for IS42RM16160K-6BLI
IS42RM16160K-6BLI Part Data Attributes
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IS42RM16160K-6BLI
Integrated Silicon Solution Inc
Buy Now
Datasheet
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IS42RM16160K-6BLI
Integrated Silicon Solution Inc
Synchronous DRAM, 16MX16, 5.5ns, CMOS, PBGA54, FBGA-54
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TFBGA, BGA54,9X9,32 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.24 | |
| Factory Lead Time | 8 Weeks | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 5.5 ns | |
| Additional Feature | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 1,2,4,8 | |
| JESD-30 Code | S-PBGA-B54 | |
| Length | 8 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 54 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA54,9X9,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 1,2,4,8,FP | |
| Standby Current-Max | 0.00001 A | |
| Supply Current-Max | 0.11 mA | |
| Supply Voltage-Max (Vsup) | 3 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |
Alternate Parts for IS42RM16160K-6BLI
This table gives cross-reference parts and alternative options found for IS42RM16160K-6BLI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS42RM16160K-6BLI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| IS42RM16160K-6BLA1 | Integrated Silicon Solution Inc | Check for Price | Synchronous DRAM, 16MX16, 5.5ns, CMOS, PBGA54, FBGA-54 | IS42RM16160K-6BLI vs IS42RM16160K-6BLA1 |
IS42RM16160K-6BLI Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the IS42RM16160K-6BLI is -40°C to 85°C.
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The power-up sequence for the IS42RM16160K-6BLI should follow the recommended sequence in the datasheet, which is VCC, then VIO, and finally CLK. This ensures proper initialization and operation of the device.
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The recommended PCB layout and routing for the IS42RM16160K-6BLI involves keeping the signal traces short and away from power and ground planes, using a solid ground plane, and avoiding vias under the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
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To troubleshoot issues with the IS42RM16160K-6BLI, start by checking the power supply and clock signals, then verify the device is properly configured and initialized. Use oscilloscopes and logic analyzers to debug the signals and identify the root cause of the issue.
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The IS42RM16160K-6BLI has a thermal pad on the bottom of the package, which should be connected to a solid ground plane on the PCB to dissipate heat. Additionally, ensure good airflow around the device and consider using a heat sink if the device is expected to operate in high-temperature environments.