-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Synchronous DRAM, 16MX16, 5ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-54
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
29X5171
|
Newark | 256M, 3.3V, Sdram, 16Mx16, 200Mhz, 54 Ball Bga (8Mm X 8Mm) Rohs |Integrated Silicon Solution (Issi) IS42S16160G-5BL RoHS: Not Compliant Min Qty: 348 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$7.2700 | Buy Now |
DISTI #
IS42S16160G-5BL
|
Avnet Americas | DRAM Chip SDRAM 256M-Bit 16M x 16 3.3V 54-Pin TFBGA - Bulk (Alt: IS42S16160G-5BL) RoHS: Compliant Min Qty: 348 Package Multiple: 348 Container: Bulk | 0 |
|
RFQ |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
IS42S16160G-5BL
Integrated Silicon Solution Inc
Buy Now
Datasheet
|
Compare Parts:
IS42S16160G-5BL
Integrated Silicon Solution Inc
Synchronous DRAM, 16MX16, 5ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-54
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Package Description | TFBGA, BGA54,9X9,32 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.24 | |
Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
Access Mode | FOUR BANK PAGE BURST | |
Access Time-Max | 5 ns | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 200 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 1,2,4,8 | |
JESD-30 Code | S-PBGA-B54 | |
Length | 8 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | SYNCHRONOUS DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 54 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 16MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA54,9X9,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Sequential Burst Length | 1,2,4,8,FP | |
Standby Current-Max | 0.004 A | |
Supply Current-Max | 0.18 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 8 mm |