There are no models available for this part yet.
Overview of IS49NLS96400A-33WBL by Integrated Silicon Solution Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for IS49NLS96400A-33WBL by Integrated Silicon Solution Inc
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
37AC0692
|
Newark | Rldram2 Memory, 576Mbit, X9, Seperate I/O, 300Mhz, Rohs, Wbga |Integrated Silicon Solution (Issi) IS49NLS96400A-33WBL RoHS: Not Compliant Min Qty: 104 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$32.7500 | Buy Now | |
DISTI #
870-49NLS96400A33WBL
|
Mouser Electronics | DRAM RLDRAM2 Memory, 576Mbit, x9, Separate I/O, 300MHz, RoHS, wBGA RoHS: Compliant | 0 |
|
$35.0600 / $36.2500 | Order Now |
CAD Models for IS49NLS96400A-33WBL by Integrated Silicon Solution Inc
Part Data Attributes for IS49NLS96400A-33WBL by Integrated Silicon Solution Inc
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
INTEGRATED SILICON SOLUTION INC
|
Package Description
|
TBGA,
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.32
|
Factory Lead Time
|
20 Weeks
|
Samacsys Manufacturer
|
Integrated Silicon Solution Inc.
|
Access Mode
|
MULTI BANK PAGE BURST
|
Additional Feature
|
AUTO REFRESH
|
JESD-30 Code
|
R-PBGA-B144
|
Length
|
18.5 mm
|
Memory Density
|
603979776 bit
|
Memory IC Type
|
DDR DRAM
|
Memory Width
|
9
|
Number of Functions
|
1
|
Number of Ports
|
1
|
Number of Terminals
|
144
|
Number of Words
|
67108864 words
|
Number of Words Code
|
64000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
95 °C
|
Operating Temperature-Min
|
|
Organization
|
64MX9
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TBGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, THIN PROFILE
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Seated Height-Max
|
1.2 mm
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
11 mm
|