Part Details for IS61NLP25636A-200B3LI by Integrated Silicon Solution Inc
Results Overview of IS61NLP25636A-200B3LI by Integrated Silicon Solution Inc
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
IS61NLP25636A-200B3LI Information
IS61NLP25636A-200B3LI by Integrated Silicon Solution Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for IS61NLP25636A-200B3LI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
43M5319
|
Newark | 8Mb,"no-Wait"/Pipeline, sync,256K X 36,200Mhz,3.3V I/O, 165 Ball Bga, Rohs |Integrated Silicon Solution/issi IS61NLP25636A-200B3LI RoHS: Not Compliant Min Qty: 144 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$13.3300 / $15.7800 | Buy Now |
|
DISTI #
IS61NLP25636A-200B3LI-ND
|
DigiKey | IC SRAM 9MBIT PARALLEL 165TFBGA Min Qty: 144 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
|
$17.1098 | Buy Now |
|
DISTI #
IS61NLP25636A-200B3LI
|
Avnet Americas | SRAM Chip Sync Quad 3.3V 9M-Bit 256K x 36 3.1ns 165-Pin BGA - Bulk (Alt: IS61NLP25636A-200B3LI) COO: China RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 12 Weeks, 0 Days Container: Bulk | 0 |
|
$12.3054 / $14.0000 | Buy Now |
|
DISTI #
870-61NLP25636A2B3LI
|
Mouser Electronics | SRAM 8Mb,"No-Wait"/Pipeline,Sync,256K x 36,200Mhz,3.3v I/O, 165 Ball BGA, RoHS RoHS: Compliant | 122 |
|
$15.8200 / $19.1300 | Buy Now |
|
DISTI #
IS61NLP25636A-200B3LI
|
Avnet Silica | SRAM Chip Sync Quad 33V 9MBit 256K x 36 31ns 165Pin BGA (Alt: IS61NLP25636A-200B3LI) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 14 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
|
|
Chip Stock | 256KX369MBIT,PipelineNoWaitStateBusSRAMZbtSRAM,256KX36,3.1NS,Cmos,PBGA165 | 369 |
|
RFQ |
US Tariff Estimator: IS61NLP25636A-200B3LI by Integrated Silicon Solution Inc
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for IS61NLP25636A-200B3LI
IS61NLP25636A-200B3LI Part Data Attributes
|
|
IS61NLP25636A-200B3LI
Integrated Silicon Solution Inc
Buy Now
Datasheet
|
Compare Parts:
IS61NLP25636A-200B3LI
Integrated Silicon Solution Inc
ZBT SRAM, 256KX36, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-165
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Part Package Code | BGA | |
| Package Description | Tbga, Bga165,11x15,40 | |
| Pin Count | 165 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | 3A991.b.2.a | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 12 Weeks | |
| Access Time-Max | 3.1 Ns | |
| Additional Feature | Pipelined Architecture | |
| Clock Frequency-Max (fCLK) | 200 Mhz | |
| I/O Type | Common | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 15 Mm | |
| Memory Density | 9437184 Bit | |
| Memory IC Type | Zbt Sram | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 262144 Words | |
| Number of Words Code | 256000 | |
| Operating Mode | Synchronous | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256kx36 | |
| Output Characteristics | 3-State | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | Rectangular | |
| Package Style | Grid Array, Thin Profile | |
| Parallel/Serial | Parallel | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 Mm | |
| Standby Current-Max | 0.05 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.28 Ma | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Industrial | |
| Terminal Form | Ball | |
| Terminal Pitch | 1 Mm | |
| Terminal Position | Bottom | |
| Width | 13 Mm |
IS61NLP25636A-200B3LI Frequently Asked Questions (FAQ)
-
The maximum operating temperature range for the IS61NLP25636A-200B3LI is -40°C to 85°C.
-
It is recommended to power up the VCC and VCCQ pins simultaneously, and power down the VCCQ pin before the VCC pin. A slow power-up and power-down sequence is also recommended to prevent latch-up.
-
A decoupling capacitor of 0.1uF to 1uF is recommended to be placed as close to the VCC pin as possible to filter out noise and reduce power supply ripple.
-
It is recommended to use a voltage supervisor or a power-on reset circuit to ensure that the SRAM is not accessed during power-down and power-up cycles, and to ensure that the SRAM is properly initialized after power-up.
-
The maximum clock frequency supported by the IS61NLP25636A-200B3LI is 200MHz.