Part Details for JANS2N5153U3 by VPT Components
Results Overview of JANS2N5153U3 by VPT Components
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Not Available)
- Number of Functional Equivalents: (0 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Audio and Video Systems
JANS2N5153U3 Information
JANS2N5153U3 by VPT Components is a Power Bipolar Transistor.
Power Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for JANS2N5153U3
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
JANS2N5153U3
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Avnet Americas | Power Silicon Transistor PNP 80VDC 10A 3-Pin Surface Mount U3 - Bulk (Alt: JANS2N5153U3) COO: United States of America (the) RoHS: Not Compliant Min Qty: 11 Package Multiple: 1 Container: Bulk | 0 |
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$114.8333 / $122.8217 | Buy Now |
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DISTI #
JANS2N5153U3
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Avnet Americas | Power Silicon Transistor PNP 80VDC 10A 3-Pin Surface Mount U3 - Bulk (Alt: JANS2N5153U3) COO: United States of America (the) RoHS: Not Compliant Min Qty: 11 Package Multiple: 1 Container: Bulk | 0 |
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$114.8333 / $122.8217 | Buy Now |
|
DISTI #
JANS2N5153U3
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TTI | Bipolar Transistors - BJT MIL-PRF-19500/545 RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Container: Waffle |
Americas - 12 In Stock |
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$140.7100 | Buy Now |
Part Details for JANS2N5153U3
JANS2N5153U3 CAD Models
JANS2N5153U3 Part Data Attributes
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JANS2N5153U3
VPT Components
Buy Now
Datasheet
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Compare Parts:
JANS2N5153U3
VPT Components
Power Bipolar Transistor, 2A I(C), 80V V(BR)CEO, 1-Element, PNP, Silicon
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| Additional Feature | High Reliability | |
| Case Connection | Collector | |
| Collector Current-Max (IC) | 2 A | |
| Collector-Base Capacitance-Max | 250 Pf | |
| Collector-Emitter Voltage-Max | 80 V | |
| Configuration | Single | |
| DC Current Gain-Min (hFE) | 40 | |
| Fall Time-Max (tf) | 500 Ns | |
| JESD-30 Code | R-XDSO-N3 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 200 °C | |
| Operating Temperature-Min | -65 °C | |
| Package Body Material | Unspecified | |
| Package Shape | Rectangular | |
| Package Style | Small Outline | |
| Peak Reflow Temperature (Cel) | Not Specified | |
| Polarity/Channel Type | Pnp | |
| Power Dissipation Ambient-Max | 1.16 W | |
| Power Dissipation-Max (Abs) | 100 W | |
| Qualification Status | Qualified | |
| Reference Standard | Mil-19500 | |
| Surface Mount | Yes | |
| Terminal Form | No Lead | |
| Terminal Position | Dual | |
| Time@Peak Reflow Temperature-Max (s) | Not Specified | |
| Transistor Element Material | Silicon | |
| Turn-off Time-Max (toff) | 1500 Ns | |
| Turn-on Time-Max (ton) | 500 Ns | |
| VCEsat-Max | 1.5 V |
JANS2N5153U3 Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 100mm², using a 2oz copper thickness, and ensuring a minimum of 10mm clearance around the device for airflow. Additionally, it is recommended to use thermal vias to dissipate heat from the top layer to the bottom layer of the PCB.
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To ensure proper soldering, it is recommended to use a soldering iron with a temperature range of 250°C to 260°C, and to apply a small amount of solder paste to the pads. The device should be placed on a flat surface and the soldering iron should be applied to the pads for 2-3 seconds. It is also recommended to use a soldering flux to reduce oxidation and improve wetting.
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The device should be stored in a dry, cool place away from direct sunlight and moisture. It should be handled with care to avoid mechanical stress, and electrostatic discharge (ESD) precautions should be taken to prevent damage. The device should be stored in its original packaging or in a similar protective package to prevent damage during transportation.
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Common issues with the device include overheating, output voltage instability, and input voltage undershoot. To troubleshoot these issues, it is recommended to check the PCB layout for thermal performance, ensure proper input voltage and current, and verify the output voltage and current. Additionally, it is recommended to check for any signs of physical damage or contamination on the device.
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The device is built to meet the reliability and quality standards of the aerospace industry, including MIL-PRF-38534 and NASA Workmanship Standards. The device is also tested to ensure compliance with environmental and electrical performance requirements, and is backed by VPT Components' warranty and quality control processes.