Part Details for K4B1G1646I-BMMA0 by Samsung Semiconductor
Overview of K4B1G1646I-BMMA0 by Samsung Semiconductor
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Applications
Consumer Electronics
Computing and Data Storage
Part Details for K4B1G1646I-BMMA0
K4B1G1646I-BMMA0 CAD Models
K4B1G1646I-BMMA0 Part Data Attributes:
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K4B1G1646I-BMMA0
Samsung Semiconductor
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Datasheet
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K4B1G1646I-BMMA0
Samsung Semiconductor
DDR DRAM, 64MX16, CMOS, PBGA96, FBGA-96
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Package Description | VFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13.3 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR3L DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Seated Height-Max | 1 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.45 V | |
| Supply Voltage-Min (Vsup) | 1.283 V | |
| Supply Voltage-Nom (Vsup) | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 7.5 mm |