Part Details for K4D551638D-TC33T by Samsung Semiconductor
Overview of K4D551638D-TC33T by Samsung Semiconductor
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Part Details for K4D551638D-TC33T
K4D551638D-TC33T CAD Models
K4D551638D-TC33T Part Data Attributes
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K4D551638D-TC33T
Samsung Semiconductor
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Datasheet
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K4D551638D-TC33T
Samsung Semiconductor
DDR DRAM, 16MX16, 0.6ns, CMOS, PDSO66,
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Package Description | TSSOP, TSSOP66,.46 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.24 | |
| Access Time-Max | 0.6 ns | |
| Clock Frequency-Max (fCLK) | 300 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 2,4,8 | |
| JESD-30 Code | R-PDSO-G66 | |
| Memory Density | 268435456 bit | |
| Memory IC Type | GDDR1 DRAM | |
| Memory Width | 16 | |
| Number of Terminals | 66 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Temperature-Max | 65 °C | |
| Operating Temperature-Min | ||
| Organization | 16MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP66,.46 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 4096 | |
| Sequential Burst Length | 2,4,8 | |
| Standby Current-Max | 0.07 A | |
| Supply Current-Max | 0.45 mA | |
| Supply Voltage-Nom (Vsup) | 2.6 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL |