Part Details for K4E660412E-TI50 by Samsung Semiconductor
Overview of K4E660412E-TI50 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for K4E660412E-TI50
K4E660412E-TI50 CAD Models
K4E660412E-TI50 Part Data Attributes:
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K4E660412E-TI50
Samsung Semiconductor
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Datasheet
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K4E660412E-TI50
Samsung Semiconductor
EDO DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Part Package Code | TSOP2 | |
Package Description | TSOP2, | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.02 | |
Access Mode | FAST PAGE WITH EDO | |
Access Time-Max | 50 ns | |
Additional Feature | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | |
JESD-30 Code | R-PDSO-G32 | |
Length | 20.95 mm | |
Memory Density | 67108864 bit | |
Memory IC Type | EDO DRAM | |
Memory Width | 4 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 32 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 16MX4 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSOP2 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Width | 10.16 mm |
Alternate Parts for K4E660412E-TI50
This table gives cross-reference parts and alternative options found for K4E660412E-TI50. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4E660412E-TI50, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TC5164405BFT-50 | IC 16M X 4 EDO DRAM, 50 ns, PDSO32, 0.400 ICNH, 1.27 MM PITCH, PLASTIC, TSOP2-32, Dynamic RAM | Toshiba America Electronic Components | K4E660412E-TI50 vs TC5164405BFT-50 |
TC5165405AFT-50 | IC 16M X 4 EDO DRAM, 50 ns, PDSO32, 0.400 INCH, PLASTIC, TSOP-32, Dynamic RAM | Toshiba America Electronic Components | K4E660412E-TI50 vs TC5165405AFT-50 |
TMS465409P-50DGC | 16MX4 EDO DRAM, 50ns, PDSO32, 0.400 INCH, PLASTIC, TSOP-32 | Texas Instruments | K4E660412E-TI50 vs TMS465409P-50DGC |
UPD4264405G5-A50-7JD | EDO DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32 | NEC Electronics Group | K4E660412E-TI50 vs UPD4264405G5-A50-7JD |
MT4LC16M4G3TG-5 | EDO DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32 | Micron Technology Inc | K4E660412E-TI50 vs MT4LC16M4G3TG-5 |
HYB3165405BT-50 | EDO DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32 | Siemens | K4E660412E-TI50 vs HYB3165405BT-50 |
HM5165405ALTT-5 | EDO DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, MO-133AC, TSOP2-32 | Hitachi Ltd | K4E660412E-TI50 vs HM5165405ALTT-5 |
M5M467405BTP-5 | EDO DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, TSOP-32 | Mitsubishi Electric | K4E660412E-TI50 vs M5M467405BTP-5 |
IBM0165405PT3C-50 | EDO DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 X 0.825 INCH, PLASTIC, TSOP2-32 | IBM | K4E660412E-TI50 vs IBM0165405PT3C-50 |
K4E660412E-TP50 | EDO DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32 | Samsung Semiconductor | K4E660412E-TI50 vs K4E660412E-TP50 |