Datasheets
K4S643232C-TC80 by: Samsung Semiconductor

Synchronous DRAM, 2MX32, 6ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86

Part Details for K4S643232C-TC80 by Samsung Semiconductor

Overview of K4S643232C-TC80 by Samsung Semiconductor

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Applications Consumer Electronics Internet of Things (IoT) Industrial Automation Computing and Data Storage Renewable Energy Robotics and Drones

Part Details for K4S643232C-TC80

K4S643232C-TC80 CAD Models

K4S643232C-TC80 Part Data Attributes

K4S643232C-TC80 Samsung Semiconductor
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K4S643232C-TC80 Samsung Semiconductor Synchronous DRAM, 2MX32, 6ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP2
Package Description 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86
Pin Count 86
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.02
Samacsys Manufacturer SAMSUNG
Access Mode FOUR BANK PAGE BURST
Access Time-Max 6 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 125 MHz
I/O Type COMMON
Interleaved Burst Length 1,2,4,8
JESD-30 Code R-PDSO-G86
JESD-609 Code e0
Length 22.22 mm
Memory Density 67108864 bit
Memory IC Type SYNCHRONOUS DRAM
Memory Width 32
Number of Functions 1
Number of Ports 1
Number of Terminals 86
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX32
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Equivalence Code TSSOP86,.46,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified
Refresh Cycles 4096
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 1,2,4,8,FP
Standby Current-Max 0.002 A
Supply Current-Max 0.16 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Width 10.16 mm

Alternate Parts for K4S643232C-TC80

This table gives cross-reference parts and alternative options found for K4S643232C-TC80. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4S643232C-TC80, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HY57V653220CTC-8 Synchronous DRAM, 2MX32, 6ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 SK Hynix Inc K4S643232C-TC80 vs HY57V653220CTC-8
HY57V643220CTP-8 Synchronous DRAM, 2MX32, 6ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.5 MM PITCH, LEAD FREE, TSOP2-86 SK Hynix Inc K4S643232C-TC80 vs HY57V643220CTP-8
HY57V653220BTC-8 Synchronous DRAM, 2MX32, 6ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 SK Hynix Inc K4S643232C-TC80 vs HY57V653220BTC-8
HY57V643220CT-8 Synchronous DRAM, 2MX32, 6ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.5 MM PITCH, TSOP2-86 SK Hynix Inc K4S643232C-TC80 vs HY57V643220CT-8
Part Number Description Manufacturer Compare
K4S643232C-TC100 Synchronous DRAM, 2MX32, 6ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 Samsung Semiconductor K4S643232C-TC80 vs K4S643232C-TC100
HY57V563220ATP-6 Synchronous DRAM, 2MX32, 5.4ns, CMOS, PDSO86, 0.400 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-86 SK Hynix Inc K4S643232C-TC80 vs HY57V563220ATP-6
W9864G2EH-6 Synchronous DRAM, 2MX32, 5ns, CMOS, PDSO86, 0.400 INCH, ROHS COMPLIANT, TSOP2-86 Winbond Electronics Corp K4S643232C-TC80 vs W9864G2EH-6
EDS6432AFTA-75TI-E Synchronous DRAM, 2MX32, 5.4ns, CMOS, PDSO86, ROHS COMPLIANT, PLASTIC, TSOP2-86 Elpida Memory Inc K4S643232C-TC80 vs EDS6432AFTA-75TI-E
HY57V643220CLT-S Synchronous DRAM, 2MX32, 6ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.5 MM PITCH, TSOP2-86 SK Hynix Inc K4S643232C-TC80 vs HY57V643220CLT-S
HY57V643220DLTP-55I Synchronous DRAM, 2MX32, 5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, LEAD FREE, TSOP2-86 SK Hynix Inc K4S643232C-TC80 vs HY57V643220DLTP-55I
MB811643221A-83FN 2MX32 SYNCHRONOUS DRAM, PDSO86, 0.400 INCH, 0.50 MM PITCH, TSOP2-86 FUJITSU Limited K4S643232C-TC80 vs MB811643221A-83FN
MT48LC2M32B2P-5 Synchronous DRAM, 2MX32, 4.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-86 Micron Technology Inc K4S643232C-TC80 vs MT48LC2M32B2P-5
MT48LC2M32B1TG-8E Synchronous DRAM, 2MX32, 6ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP-86 Micron Technology Inc K4S643232C-TC80 vs MT48LC2M32B1TG-8E
MB811643222A-125FN 2MX32 SYNCHRONOUS DRAM, PDSO86, 0.400 INCH, 0.50 MM PITCH, TSOP2-86 FUJITSU Limited K4S643232C-TC80 vs MB811643222A-125FN

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