Datasheets
K4S643232E-TP700 by: Samsung Semiconductor

Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86

Part Details for K4S643232E-TP700 by Samsung Semiconductor

Overview of K4S643232E-TP700 by Samsung Semiconductor

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Part Details for K4S643232E-TP700

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K4S643232E-TP700 Part Data Attributes

K4S643232E-TP700 Samsung Semiconductor
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K4S643232E-TP700 Samsung Semiconductor Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP2
Package Description TSOP2,
Pin Count 86
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Mode FOUR BANK PAGE BURST
Access Time-Max 5.5 ns
Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PDSO-G86
Length 22.22 mm
Memory Density 67108864 bit
Memory IC Type SYNCHRONOUS DRAM
Memory Width 32
Number of Functions 1
Number of Ports 1
Number of Terminals 86
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -45 °C
Organization 2MX32
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 10.16 mm

Alternate Parts for K4S643232E-TP700

This table gives cross-reference parts and alternative options found for K4S643232E-TP700. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4S643232E-TP700, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
K4S643232C-TC700 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 Samsung Semiconductor K4S643232E-TP700 vs K4S643232C-TC700
W9864G2EH-7 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, ROHS COMPLIANT, TSOP2-86 Winbond Electronics Corp K4S643232E-TP700 vs W9864G2EH-7
IS42S32200C1-7TL-TR Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, PLASTIC, TSOP2-86 Integrated Silicon Solution Inc K4S643232E-TP700 vs IS42S32200C1-7TL-TR
K4S643232E-TL700 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 Samsung Semiconductor K4S643232E-TP700 vs K4S643232E-TL700
IS42S32200E-7TL 2MX32 SYNCHRONOUS DRAM, 5.5ns, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 ABLIC Inc. K4S643232E-TP700 vs IS42S32200E-7TL
MT48LC2M32B2-7S Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP-86 Micron Technology Inc K4S643232E-TP700 vs MT48LC2M32B2-7S
IS42S32200-6T Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, TSOP2-86 Integrated Silicon Solution Inc K4S643232E-TP700 vs IS42S32200-6T
IS45S32200E-75ETLA1 2MX32 SYNCHRONOUS DRAM, 5.5ns, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 ABLIC Inc. K4S643232E-TP700 vs IS45S32200E-75ETLA1
K4S643232E-TE70 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 Samsung Semiconductor K4S643232E-TP700 vs K4S643232E-TE70
MT48LC2M32B1TG-7 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP-86 Micron Technology Inc K4S643232E-TP700 vs MT48LC2M32B1TG-7
Part Number Description Manufacturer Compare
MT48LC2M32B2P-7:GITTR Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-86 Micron Technology Inc K4S643232E-TP700 vs MT48LC2M32B2P-7:GITTR
K4S643232F-TC70 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 Samsung Semiconductor K4S643232E-TP700 vs K4S643232F-TC70
IS42S32200B-6T Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP2-86 Integrated Silicon Solution Inc K4S643232E-TP700 vs IS42S32200B-6T
W986432AH-7 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, 0.50 MM PITCH, TSOP2-86 Winbond Electronics Corp K4S643232E-TP700 vs W986432AH-7
IS42S32200E-7TL-TR Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 Integrated Silicon Solution Inc K4S643232E-TP700 vs IS42S32200E-7TL-TR
KM432S2030CT-G6 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 Samsung Semiconductor K4S643232E-TP700 vs KM432S2030CT-G6
K4S643232E-TL60 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 Samsung Semiconductor K4S643232E-TP700 vs K4S643232E-TL60
UPD4564323G5-A70-9JH Synchronous DRAM, 2MX32, 5.5ns, MOS, PDSO86, 0.400 INCH, PLASTIC, TSOP2-86 Elpida Memory Inc K4S643232E-TP700 vs UPD4564323G5-A70-9JH
IS42S32200B-6TLI Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, PLASTIC, TSOP2-86 Integrated Silicon Solution Inc K4S643232E-TP700 vs IS42S32200B-6TLI
IS42S32200E-7TLI-TR Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 Integrated Silicon Solution Inc K4S643232E-TP700 vs IS42S32200E-7TLI-TR

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