Datasheets
K8D3216UBCLC0700 by: Samsung Semiconductor

Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, TBGA-48

Part Details for K8D3216UBCLC0700 by Samsung Semiconductor

Overview of K8D3216UBCLC0700 by Samsung Semiconductor

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Part Details for K8D3216UBCLC0700

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K8D3216UBCLC0700 Part Data Attributes

K8D3216UBCLC0700 Samsung Semiconductor
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K8D3216UBCLC0700 Samsung Semiconductor Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, TBGA-48
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA
Package Description 6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, TBGA-48
Pin Count 48
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns
Alternate Memory Width 8
Boot Block BOTTOM
JESD-30 Code R-PBGA-B48
Length 8.5 mm
Memory Density 33554432 bit
Memory IC Type FLASH
Memory Width 16
Number of Functions 1
Number of Terminals 48
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Programming Voltage 2.7 V
Qualification Status Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Type NOR TYPE
Width 6 mm

Alternate Parts for K8D3216UBCLC0700

This table gives cross-reference parts and alternative options found for K8D3216UBCLC0700. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K8D3216UBCLC0700, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
SST39VF3201B-70-4I-B3KE-T SST39VF3201B-70-4I-B3KE-T Microchip Technology Inc K8D3216UBCLC0700 vs SST39VF3201B-70-4I-B3KE-T
PH28F320B3BD70 Flash, 2MX16, 70ns, PBGA48, LEAD FREE, VFBGA-48 Numonyx Memory Solutions K8D3216UBCLC0700 vs PH28F320B3BD70
SST39VF3201-70-4C-B3KE 2M X 16 FLASH 2.7V PROM, 70 ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 Microchip Technology Inc K8D3216UBCLC0700 vs SST39VF3201-70-4C-B3KE
SST36VF3203-70-4I-B3K Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, MO-210AB-1, TFBGA-48 Silicon Storage Technology K8D3216UBCLC0700 vs SST36VF3203-70-4I-B3K
K8D3216UBCTI0700 Flash, 2MX16, 70ns, PBGA48, 6 X 8.5 MM, 0.80 MM PITCH, TBGA-48 Samsung Semiconductor K8D3216UBCLC0700 vs K8D3216UBCTI0700
K8D3216UBCLI0700 Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, TBGA-48 Samsung Semiconductor K8D3216UBCLC0700 vs K8D3216UBCLI0700
K8D3216UBC-DI070 Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 Samsung Semiconductor K8D3216UBCLC0700 vs K8D3216UBC-DI070
SST39VF3201-70-4C-B3KE-T IC,EEPROM,NOR FLASH,2MX16,CMOS,BGA,48PIN,PLASTIC Microchip Technology Inc K8D3216UBCLC0700 vs SST39VF3201-70-4C-B3KE-T
K8D3216UBC-TC070 Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 Samsung Semiconductor K8D3216UBCLC0700 vs K8D3216UBC-TC070
SST39VF3201B-70-4I-B3KE 2M X 16 FLASH 2.7V PROM, 70 ns, PBGA48, 6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 Microchip Technology Inc K8D3216UBCLC0700 vs SST39VF3201B-70-4I-B3KE
Part Number Description Manufacturer Compare
K8D3216UBC-TI070 Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 Samsung Semiconductor K8D3216UBCLC0700 vs K8D3216UBC-TI070
K8D3216UBCYI0700 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 Samsung Semiconductor K8D3216UBCLC0700 vs K8D3216UBCYI0700
K8D3216UBCFI0700 Flash, 2MX16, 70ns, PBGA48, 6 X 8.5 MM, 0.80 MM PITCH, FBGA-48 Samsung Semiconductor K8D3216UBCLC0700 vs K8D3216UBCFI0700
K8D3216UBC-FC070 Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, FBGA-48 Samsung Semiconductor K8D3216UBCLC0700 vs K8D3216UBC-FC070
K8D3216UBC-DI070 Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 Samsung Semiconductor K8D3216UBCLC0700 vs K8D3216UBC-DI070
SST39VF3201B-70-4I-EKE-T 2M X 16 FLASH 2.7V PROM, 70 ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 Microchip Technology Inc K8D3216UBCLC0700 vs SST39VF3201B-70-4I-EKE-T
TE28F320B3BD70 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, TSOP-48 Numonyx Memory Solutions K8D3216UBCLC0700 vs TE28F320B3BD70
K8D3216UBCDI0700 Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 Samsung Semiconductor K8D3216UBCLC0700 vs K8D3216UBCDI0700
SST39VF3201-70-4I-EKE-T 2M X 16 FLASH 2.7V PROM, 70 ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48 Microchip Technology Inc K8D3216UBCLC0700 vs SST39VF3201-70-4I-EKE-T
K8D3216UBC-FI070 Flash, 2MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, FBGA-48 Samsung Semiconductor K8D3216UBCLC0700 vs K8D3216UBC-FI070

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