Part Details for K9F1208D0B-HIB00 by Samsung Semiconductor
Overview of K9F1208D0B-HIB00 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for K9F1208D0B-HIB00
K9F1208D0B-HIB00 CAD Models
K9F1208D0B-HIB00 Part Data Attributes
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K9F1208D0B-HIB00
Samsung Semiconductor
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Datasheet
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K9F1208D0B-HIB00
Samsung Semiconductor
Flash, 64MX8, 30ns, PBGA63, LEAD FREE, FBGA-63
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | VFBGA, | |
| Pin Count | 63 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 30 ns | |
| Additional Feature | CONTAINS ADDITIONAL 16M BIT SPARE MEMORY | |
| JESD-30 Code | R-PBGA-B63 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 2 | |
| Number of Functions | 1 | |
| Number of Terminals | 63 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 2.7 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max (Vsup) | 2.9 V | |
| Supply Voltage-Min (Vsup) | 2.4 V | |
| Supply Voltage-Nom (Vsup) | 2.65 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 8.5 mm |
Alternate Parts for K9F1208D0B-HIB00
This table gives cross-reference parts and alternative options found for K9F1208D0B-HIB00. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K9F1208D0B-HIB00, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| K9F1208D0B-DCB0 | Flash, 64MX8, 30ns, PBGA63, | Samsung Semiconductor | K9F1208D0B-HIB00 vs K9F1208D0B-DCB0 |
| K9F1208D0B-HIB0 | Flash, 64MX8, 30ns, PBGA63, | Samsung Semiconductor | K9F1208D0B-HIB00 vs K9F1208D0B-HIB0 |
| K9F1208D0B-HCB00 | Flash, 64MX8, 30ns, PBGA63, LEAD FREE, FBGA-63 | Samsung Semiconductor | K9F1208D0B-HIB00 vs K9F1208D0B-HCB00 |
| K9F1208D0B-DCB00 | Flash, 64MX8, 30ns, PBGA63, FBGA-63 | Samsung Semiconductor | K9F1208D0B-HIB00 vs K9F1208D0B-DCB00 |