Part Details for K9F5608R0D-JIB0 by Samsung Semiconductor
Overview of K9F5608R0D-JIB0 by Samsung Semiconductor
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- Number of Functional Equivalents:
- Part Data Attributes
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Part Details for K9F5608R0D-JIB0
K9F5608R0D-JIB0 CAD Models
K9F5608R0D-JIB0 Part Data Attributes
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K9F5608R0D-JIB0
Samsung Semiconductor
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Datasheet
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K9F5608R0D-JIB0
Samsung Semiconductor
Flash, 32MX8, 35ns, PBGA63
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 35 ns | |
| Command User Interface | YES | |
| Data Polling | NO | |
| JESD-30 Code | R-PBGA-B63 | |
| JESD-609 Code | e3 | |
| Memory Density | 268435456 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Sectors/Size | 2K | |
| Number of Terminals | 63 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA63,10X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Page Size | 512 words | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Sector Size | 16K | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.02 mA | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Toggle Bit | NO |
Alternate Parts for K9F5608R0D-JIB0
This table gives cross-reference parts and alternative options found for K9F5608R0D-JIB0. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K9F5608R0D-JIB0, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NAND256W3A0DZA6E | Flash, 32MX8, 12000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | Numonyx Memory Solutions | K9F5608R0D-JIB0 vs NAND256W3A0DZA6E |
| NAND256W3A3CZA1T | Flash, 32MX8, 12000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | Numonyx Memory Solutions | K9F5608R0D-JIB0 vs NAND256W3A3CZA1T |
| HY27US08561A-FES | Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, FBGA-63 | SK Hynix Inc | K9F5608R0D-JIB0 vs HY27US08561A-FES |
| NAND256W3A0DZA1 | Flash, 32MX8, 12000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | Numonyx Memory Solutions | K9F5608R0D-JIB0 vs NAND256W3A0DZA1 |
| K9F5608D0D-JCB00 | Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 0.80 MM PITCH, LEAD FREE, FBGA-63 | Samsung Semiconductor | K9F5608R0D-JIB0 vs K9F5608D0D-JCB00 |
| NAND256W3A0DZA6E | 32MX8 FLASH 3V PROM, 12000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | STMicroelectronics | K9F5608R0D-JIB0 vs NAND256W3A0DZA6E |
| NAND256R3A3DZA1 | Flash, 32MX8, 15000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | Numonyx Memory Solutions | K9F5608R0D-JIB0 vs NAND256R3A3DZA1 |
| NAND256W3A3BZA1 | 32MX8 FLASH 3V PROM, 12000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | STMicroelectronics | K9F5608R0D-JIB0 vs NAND256W3A3BZA1 |
| K9F5608B0D-JCB00 | Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63 | Samsung Semiconductor | K9F5608R0D-JIB0 vs K9F5608B0D-JCB00 |
| NAND256W3A3BZA6E | Flash, 32MX8, 12000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-63 | Numonyx Memory Solutions | K9F5608R0D-JIB0 vs NAND256W3A3BZA6E |