Part Details for L8C401CC25 by LOGIC Devices Inc
Overview of L8C401CC25 by LOGIC Devices Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for L8C401CC25
L8C401CC25 CAD Models
L8C401CC25 Part Data Attributes
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L8C401CC25
LOGIC Devices Inc
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Datasheet
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L8C401CC25
LOGIC Devices Inc
FIFO, 64X4, 35ns, Asynchronous, CMOS, CDIP16, 0.300 INCH, CERDIP-16
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | LOGIC DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 16 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 15 ns | |
| Cycle Time | 25 ns | |
| JESD-30 Code | R-GDIP-T16 | |
| Length | 20.32 mm | |
| Memory Density | 36864 bit | |
| Memory IC Type | OTHER FIFO | |
| Memory Width | 9 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 64 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4KX9 | |
| Output Characteristics | TOTEM POLE | |
| Output Enable | NO | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.12 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for L8C401CC25
This table gives cross-reference parts and alternative options found for L8C401CC25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of L8C401CC25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 74HCT7403N,112 | 74HC(T)7403 - 4-Bit x 64-word FIFO register; 3-state DIP 16-Pin | NXP Semiconductors | L8C401CC25 vs 74HCT7403N,112 |
| 5962-8779107EA | FIFO, 64X4, 65ns, Asynchronous, TTL, CDIP16, CERAMIC, DIP-16 | Monolithic Memories (RETIRED) | L8C401CC25 vs 5962-8779107EA |
| 67401J | FIFO, 64X4, Asynchronous, TTL, CDIP16, | Monolithic Memories (RETIRED) | L8C401CC25 vs 67401J |
| L8C403CC20 | FIFO, 64X4, 45ns, Asynchronous, CMOS, CDIP16, 0.300 INCH, CERDIP-16 | LOGIC Devices Inc | L8C401CC25 vs L8C403CC20 |
| L8C401PC25 | FIFO, 64X4, 35ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 | LOGIC Devices Inc | L8C401CC25 vs L8C401PC25 |
| 5962-8952301EX | FIFO, 64X4, 35ns, Asynchronous, CMOS, 0.840 X 0.310 INCH, 0.200 INCH HIEGHT, DIP-16 | Cypress Semiconductor | L8C401CC25 vs 5962-8952301EX |
| 67401AJ | FIFO, 64X4, Asynchronous, TTL, CDIP16, | Monolithic Memories (RETIRED) | L8C401CC25 vs 67401AJ |
| L8C401PC35 | FIFO, 64X4, 25ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 | LOGIC Devices Inc | L8C401CC25 vs L8C401PC35 |
| 5962-8779112EA | FIFO, 64X4, Asynchronous, CMOS, CDIP16, CERAMIC, DIP-16 | SRI International Sarnoff | L8C401CC25 vs 5962-8779112EA |
| CY7C403-15PC | FIFO, 64X4, 40ns, Asynchronous, CMOS, PDIP16, 0.300 INCH, DIP-16 | Cypress Semiconductor | L8C401CC25 vs CY7C403-15PC |