Part Details for LMV228SD by National Semiconductor Corporation
Overview of LMV228SD by National Semiconductor Corporation
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Applications
Consumer Electronics
Part Details for LMV228SD
LMV228SD CAD Models
LMV228SD Part Data Attributes
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LMV228SD
National Semiconductor Corporation
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LMV228SD
National Semiconductor Corporation
IC TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, DSO6, 2.20 X 2.50 MM, 0.80 MM HEIGHT, LLP-6, Cellular Telephone Circuit
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Package Description | 2.20 X 2.50 MM, 0.80 MM HEIGHT, LLP-6 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | R-XDSO-N6 | |
JESD-609 Code | e0 | |
Length | 2.5 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 6 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVSON | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.8 mm | |
Supply Voltage-Nom | 2.7 V | |
Surface Mount | YES | |
Telecom IC Type | RF AND BASEBAND CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Lead (Sn85Pb15) | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 2.2 mm |