Part Details for LSP1000-252A by Microsemi Corporation
Overview of LSP1000-252A by Microsemi Corporation
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Part Details for LSP1000-252A
LSP1000-252A CAD Models
LSP1000-252A Part Data Attributes:
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LSP1000-252A
Microsemi Corporation
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LSP1000-252A
Microsemi Corporation
Pin Diode, 35V V(BR), Silicon, CERAMIC PLASTIC PACKAGE-4
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | R-XBCC-N4 | |
| Pin Count | 4 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Application | SWITCHING | |
| Breakdown Voltage-Min | 35 V | |
| Configuration | SINGLE | |
| Diode Capacitance-Max | 0.28 pF | |
| Diode Element Material | SILICON | |
| Diode Forward Resistance-Max | 2.5 Ω | |
| Diode Type | PIN DIODE | |
| Frequency Band | C BAND | |
| JESD-30 Code | R-XBCC-N4 | |
| JESD-609 Code | e0 | |
| Minority Carrier Lifetime-Nom | 0.08 µs | |
| Number of Elements | 1 | |
| Number of Terminals | 4 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -65 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Power Dissipation-Max | 0.5 W | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Technology | POSITIVE-INTRINSIC-NEGATIVE | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | NO LEAD | |
| Terminal Position | BOTTOM |