Part Details for LSP1002-454-3 by Microsemi Corporation
Overview of LSP1002-454-3 by Microsemi Corporation
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Part Details for LSP1002-454-3
LSP1002-454-3 CAD Models
LSP1002-454-3 Part Data Attributes:
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LSP1002-454-3
Microsemi Corporation
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LSP1002-454-3
Microsemi Corporation
Pin Diode, 100V V(BR), Silicon, ROHS COMPLIANT, PLASTIC, CASE 454-3, 3 PIN
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | ROHS COMPLIANT, PLASTIC, CASE 454-3, 3 PIN | |
| Pin Count | 3 | |
| Manufacturer Package Code | CASE 454-3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Application | ATTENUATOR | |
| Breakdown Voltage-Min | 100 V | |
| Configuration | COMMON ANODE, 2 ELEMENTS | |
| Diode Capacitance-Max | 0.32 pF | |
| Diode Capacitance-Nom | 0.32 pF | |
| Diode Element Material | SILICON | |
| Diode Forward Resistance-Max | 4 Ω | |
| Diode Res Test Current | 100 mA | |
| Diode Res Test Frequency | 100 MHz | |
| Diode Type | PIN DIODE | |
| Frequency Band | C BAND | |
| JESD-30 Code | R-PDSO-N3 | |
| Minority Carrier Lifetime-Nom | 1.5 µs | |
| Number of Elements | 2 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 125 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Power Dissipation-Max | 0.5 W | |
| Qualification Status | Not Qualified | |
| Reverse Test Voltage | 50 V | |
| Surface Mount | YES | |
| Technology | POSITIVE-INTRINSIC-NEGATIVE | |
| Terminal Form | NO LEAD | |
| Terminal Position | DUAL |