Datasheets
M27C801-150B1 by: STMicroelectronics

1MX8 OTPROM, 150ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32

Part Details for M27C801-150B1 by STMicroelectronics

Overview of M27C801-150B1 by STMicroelectronics

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Applications Consumer Electronics Industrial Automation

Part Details for M27C801-150B1

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M27C801-150B1 Part Data Attributes

M27C801-150B1 STMicroelectronics
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M27C801-150B1 STMicroelectronics 1MX8 OTPROM, 150ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code DIP
Package Description 0.600 INCH, LEAD FREE, PLASTIC, DIP-32
Pin Count 32
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 150 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T32
JESD-609 Code e3
Length 42.035 mm
Memory Density 8388608 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.83 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for M27C801-150B1

This table gives cross-reference parts and alternative options found for M27C801-150B1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C801-150B1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M27C801-100B1 1MX8 OTPROM, 100ns, PDIP32, 0.600 INCH, ROHS COMPLIANT, PLASTIC, DIP-32 STMicroelectronics M27C801-150B1 vs M27C801-100B1
MX27C8000APC-10 OTP ROM, 1MX8, 100ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Macronix International Co Ltd M27C801-150B1 vs MX27C8000APC-10
M27C801-120B1 1MX8 OTPROM, 120ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32 STMicroelectronics M27C801-150B1 vs M27C801-120B1
Part Number Description Manufacturer Compare
M27W801-200F6TR 1MX8 UVPROM, 120ns, CDIP32, CERAMIC, DIP-32 STMicroelectronics M27C801-150B1 vs M27W801-200F6TR
UPD23C8001ECZ MASK ROM, 1MX8, 250ns, CMOS, PDIP32, PLASTIC, DIP-32 NEC Electronics America Inc M27C801-150B1 vs UPD23C8001ECZ
M27V801-120P1 1MX8 OTPROM, 120ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 STMicroelectronics M27C801-150B1 vs M27V801-120P1
M27V801-150P6TR 1MX8 OTPROM, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 STMicroelectronics M27C801-150B1 vs M27V801-150P6TR
M27C801-60B1TR 1MX8 OTPROM, 60ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32 STMicroelectronics M27C801-150B1 vs M27C801-60B1TR
M27C801-120B1 1MX8 OTPROM, 120ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32 STMicroelectronics M27C801-150B1 vs M27C801-120B1
AM27C080-120DI UVPROM, 1MX8, 120ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD M27C801-150B1 vs AM27C080-120DI
MR27V801DRA OTP ROM, 1MX8, 100ns, CMOS, PDIP32, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-32 LAPIS Semiconductor Co Ltd M27C801-150B1 vs MR27V801DRA
M27C801-150F1TR 1MX8 UVPROM, 150ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics M27C801-150B1 vs M27C801-150F1TR
KM23C8000D-12 MASK ROM, 1MX8, 120ns, CMOS, PDIP32, 0.600 INCH, DIP-32 Samsung Semiconductor M27C801-150B1 vs KM23C8000D-12

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