Datasheets
M27W800-100B6 by: STMicroelectronics

512KX16 OTPROM, 100ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42

Part Details for M27W800-100B6 by STMicroelectronics

Overview of M27W800-100B6 by STMicroelectronics

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for M27W800-100B6

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M27W800-100B6 Part Data Attributes

M27W800-100B6 STMicroelectronics
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M27W800-100B6 STMicroelectronics 512KX16 OTPROM, 100ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code DIP
Package Description DIP,
Pin Count 42
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 100 ns
Alternate Memory Width 8
JESD-30 Code R-PDIP-T42
Length 52.455 mm
Memory Density 8388608 bit
Memory IC Type OTP ROM
Memory Width 16
Number of Functions 1
Number of Terminals 42
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX16
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for M27W800-100B6

This table gives cross-reference parts and alternative options found for M27W800-100B6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27W800-100B6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MR27V852ERA OTP ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 OKI Electric Industry Co Ltd M27W800-100B6 vs MR27V852ERA
Part Number Description Manufacturer Compare
K3N4C1000E-DC120 MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42 Samsung Semiconductor M27W800-100B6 vs K3N4C1000E-DC120
K3P4C1000E-DC100 MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 Samsung Semiconductor M27W800-100B6 vs K3P4C1000E-DC100
MSM27C802ZB-NRS OTP ROM, 1MX8, 120ns, CMOS, PDIP42, PLASTIC, DIP-42 OKI Electric Industry Co Ltd M27W800-100B6 vs MSM27C802ZB-NRS
LH538600D-10 MASK ROM, 1MX8, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 Sharp Corp M27W800-100B6 vs LH538600D-10
MR53V8002J-XXRA MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 LAPIS Semiconductor Co Ltd M27W800-100B6 vs MR53V8002J-XXRA
AM27C800-125DEB UVPROM, 1MX8, 120ns, CMOS, CDIP42, WINDOWED, CERAMIC, DIP-42 AMD M27W800-100B6 vs AM27C800-125DEB
LH53B8V00D MASK ROM, 1MX8, 85ns, CMOS, PDIP42, DIP-42 Sharp Corp M27W800-100B6 vs LH53B8V00D
AM27C800-250/BXA UVPROM, 1MX8, 250ns, CMOS, CDIP42, WINDOWED, CERAMIC, DIP-42 AMD M27W800-100B6 vs AM27C800-250/BXA
MR53V8052J-XXRA MASK ROM, 512KX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 LAPIS Semiconductor Co Ltd M27W800-100B6 vs MR53V8052J-XXRA
M27C800-150XF6 512KX16 UVPROM, 120ns, CDIP42, WINDOWED, FRIT SEALED, CERAMIC, DIP-42 STMicroelectronics M27W800-100B6 vs M27C800-150XF6

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