Datasheets
M368L3324DUS-CCC by: Samsung Semiconductor

DDR DRAM Module, 32MX64, 0.65ns, CMOS, ROHS COMPLIANT, DIMM-184

Part Details for M368L3324DUS-CCC by Samsung Semiconductor

Overview of M368L3324DUS-CCC by Samsung Semiconductor

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Applications Computing and Data Storage

Part Details for M368L3324DUS-CCC

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M368L3324DUS-CCC Part Data Attributes

M368L3324DUS-CCC Samsung Semiconductor
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M368L3324DUS-CCC Samsung Semiconductor DDR DRAM Module, 32MX64, 0.65ns, CMOS, ROHS COMPLIANT, DIMM-184
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code DIMM
Package Description DIMM, DIMM184
Pin Count 184
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.36
Access Mode SINGLE BANK PAGE BURST
Access Time-Max 0.65 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-XDMA-N184
Length 133.35 mm
Memory Density 2147483648 bit
Memory IC Type DDR DRAM MODULE
Memory Width 64
Number of Functions 1
Number of Ports 1
Number of Terminals 184
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32MX64
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED
Package Code DIMM
Package Equivalence Code DIMM184
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 2.47 mm
Self Refresh YES
Supply Current-Max 1.6 mA
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.5 V
Supply Voltage-Nom (Vsup) 2.6 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 31.75 mm

Alternate Parts for M368L3324DUS-CCC

This table gives cross-reference parts and alternative options found for M368L3324DUS-CCC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M368L3324DUS-CCC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
V826632K24SAIW-D0 DDR DRAM Module, 32MX64, 0.65ns, CMOS, GREEN, DIMM-184 ProMOS Technologies Inc M368L3324DUS-CCC vs V826632K24SAIW-D0
M368L3223DTM-CCC DDR DRAM Module, 32MX64, 0.65ns, CMOS, DIMM-184 Samsung Semiconductor M368L3324DUS-CCC vs M368L3223DTM-CCC
M368L3223JUS-LCC DDR DRAM Module, 32MX64, 0.65ns, CMOS, ROHS COMPLIANT, DIMM-184 Samsung Semiconductor M368L3324DUS-CCC vs M368L3223JUS-LCC
M368L3223ETM-LCC DDR DRAM Module, 32MX64, 0.65ns, CMOS, DIMM-184 Samsung Semiconductor M368L3324DUS-CCC vs M368L3223ETM-LCC
M368L3223DTM-LCC DDR DRAM Module, 32MX64, 0.65ns, CMOS, DIMM-184 Samsung Semiconductor M368L3324DUS-CCC vs M368L3223DTM-LCC
M368L3223EUM-LCC DDR DRAM Module, 32MX64, 0.65ns, CMOS, ROHS COMPLIANT, DIMM-184 Samsung Semiconductor M368L3324DUS-CCC vs M368L3223EUM-LCC
V826632K24SAIX-D3 DDR DRAM Module, 32MX64, 0.65ns, CMOS, GREEN, DIMM-184 ProMOS Technologies Inc M368L3324DUS-CCC vs V826632K24SAIX-D3
M368L3324DUS-LCC DDR DRAM Module, 32MX64, 0.65ns, CMOS, ROHS COMPLIANT, DIMM-184 Samsung Semiconductor M368L3324DUS-CCC vs M368L3324DUS-LCC
V826632K24SATG-D0 32M X 64 DDR DRAM MODULE, 0.65 ns, DMA184, DIMM-184 ProMOS Technologies Inc M368L3324DUS-CCC vs V826632K24SATG-D0
V826632K24SAIW-D3 DDR DRAM Module, 32MX64, 0.65ns, CMOS, GREEN, DIMM-184 ProMOS Technologies Inc M368L3324DUS-CCC vs V826632K24SAIW-D3
Part Number Description Manufacturer Compare
M368L3324BUM-LCC DDR DRAM Module, 32MX64, 0.65ns, CMOS, ROHS COMPLIANT, DIMM-184 Samsung Semiconductor M368L3324DUS-CCC vs M368L3324BUM-LCC
V916632B24QAFW-E4 DDR DRAM Module, 32MX64, 0.5ns, CMOS, ROHS COMPLIANT, SODIMM-200 ProMOS Technologies Inc M368L3324DUS-CCC vs V916632B24QAFW-E4
M368L3324BUM-LAA DDR DRAM Module, 32MX64, 0.75ns, CMOS, ROHS COMPLIANT, DIMM-184 Samsung Semiconductor M368L3324DUS-CCC vs M368L3324BUM-LAA
NT256D64SH8C0GM-75B DDR DRAM Module, 32MX64, 0.75ns, CMOS, SODIMM-200 Nanya Technology Corporation M368L3324DUS-CCC vs NT256D64SH8C0GM-75B
V826632K24SXTG-D0 DDR DRAM Module, 32MX64, 0.65ns, CMOS, DIMM-184 Mosel Vitelic Corporation M368L3324DUS-CCC vs V826632K24SXTG-D0
HYMP532S64CLP6-E3 DDR DRAM Module, 32MX64, 0.6ns, CMOS, ROHS COMPLIANT, DIMM-200 SK Hynix Inc M368L3324DUS-CCC vs HYMP532S64CLP6-E3
VR4CU326428CBK DDR DRAM Module, 32MX64, 0.7ns, CMOS, ROHS COMPLIANT, DIMM-184 Viking Technology M368L3324DUS-CCC vs VR4CU326428CBK
M470T3354BZ3-CCC DDR DRAM Module, 32MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200 Samsung Semiconductor M368L3324DUS-CCC vs M470T3354BZ3-CCC
NT256D64SH8BAGM-75B DDR DRAM Module, 32MX64, 0.75ns, CMOS, SODIMM-200 Nanya Technology Corporation M368L3324DUS-CCC vs NT256D64SH8BAGM-75B
WV3EG6434S335BD4SG DDR DRAM Module, 32MX64, 0.7ns, CMOS, ROHS COMPLIANT, SO-DIMM-200 Microsemi Corporation M368L3324DUS-CCC vs WV3EG6434S335BD4SG

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