M38510/23112BWX
Description: Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22

Overview of M38510/23112BWX by Harris Semiconductor

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Aerospace and Defense Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
M38510/12907BPA Rochester Electronics LLC And Gate Based Peripheral Driver, 2 Driver, 0.5A, BIPolar, CDIP8, CERAMIC, DIP-8
54LS242/BCA Rochester Electronics LLC 54LS242/BCA (DM: M38510/32801BCA)
5438/BCA Rochester Electronics 5438/BCA (DM: M38510/00303BCA)

CAD Models for M38510/23112BWX by Harris Semiconductor
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Part Data Attributes for M38510/23112BWX by Harris Semiconductor

M38510/23112BWX
Harris Semiconductor
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
Package Description
DIP,
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
75 ns
JESD-30 Code
R-XDIP-T22
Memory Density
1024 bit
Memory IC Type
STANDARD SRAM
Memory Width
4
Number of Functions
1
Number of Terminals
22
Number of Words
256 words
Number of Words Code
256
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
256X4
Package Body Material
UNSPECIFIED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
TTL
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
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  1. M38510/23112BWX
    Harris Semiconductor
    Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22
    VS

Alternate Parts for M38510/23112BWX

This table gives cross-reference parts and alternative options found for M38510/23112BWX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M38510/23112BWX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
93L422DM Cache SRAM, 256X4, 75ns, CMOS, CDIP22, 0.400 INCH, CERDIP-22 Fairchild Semiconductor Corporation M38510/23112BWX vs 93L422DM
M38510/23112BWA Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22 Motorola Semiconductor Products M38510/23112BWX vs M38510/23112BWA
M38510/23112BWX Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22 SRI International Sarnoff M38510/23112BWX vs M38510/23112BWX
93L422/BWAJC 256X4 STANDARD SRAM, 75ns, CDIP22, 736-05 Motorola Mobility LLC M38510/23112BWX vs 93L422/BWAJC
M38510/23112BWA 256X4 STANDARD SRAM, 75ns, DIP22, 0.375 X 0.875 INCH, DIP-22 Motorola Mobility LLC M38510/23112BWX vs M38510/23112BWA
CY93L422DMB Standard SRAM, 256X4, 75ns, CMOS, CDIP22, 0.400 INCH, CERDIP-22 Cypress Semiconductor M38510/23112BWX vs CY93L422DMB
M38510/23112BWX 256X4 STANDARD SRAM, 75ns, DIP22, 0.375 X 0.875 INCH, DIP-22 STMicroelectronics M38510/23112BWX vs M38510/23112BWX
5962-3823112BWX 256 X 4 STANDARD SRAM, 75 ns, DIP22, 0.375 X 0.875 INCH, DIP-22 Motorola Mobility LLC M38510/23112BWX vs 5962-3823112BWX
M38510/23112BWX 256X4 STANDARD SRAM, 75ns, DIP22, 0.375 X 0.875 INCH, DIP-22 Motorola Mobility LLC M38510/23112BWX vs M38510/23112BWX
M38510/23112BWA Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22 SRI International Sarnoff M38510/23112BWX vs M38510/23112BWA
Part Number Description Manufacturer Compare
P4C422-20CC Standard SRAM, 256X4, 20ns, CMOS, CDIP22, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-22 Pyramid Semiconductor Corporation M38510/23112BWX vs P4C422-20CC
CY7C122-15DC Standard SRAM, 256X4, 15ns, CMOS, CDIP22, 0.400 INCH, CERDIP-22 Cypress Semiconductor M38510/23112BWX vs CY7C122-15DC
P4C422-25DC Standard SRAM, 256X4, 25ns, CMOS, CDIP22, 0.400 INCH, CERAMIC, DIP-22 Pyramid Semiconductor Corporation M38510/23112BWX vs P4C422-25DC
P4C422-15DM Standard SRAM, 256X4, 15ns, CMOS, CDIP22, 0.400 INCH, CERAMIC, DIP-22 Pyramid Semiconductor Corporation M38510/23112BWX vs P4C422-15DM
MAL5101CS Standard SRAM, 256X4, 130ns, CMOS, CDIP22, Plessey Semiconductors Ltd M38510/23112BWX vs MAL5101CS
AM93422APCB Standard SRAM, 256X4, 35ns, TTL, PDIP22, PLASTIC, DIP-22 AMD M38510/23112BWX vs AM93422APCB
HM1-6551-9 256X4 STANDARD SRAM, 300ns, CDIP22 Intersil Corporation M38510/23112BWX vs HM1-6551-9
P4C422-20PM Standard SRAM, 256X4, 20ns, CMOS, PDIP22, 0.400 INCH, PLASTIC, DIP-22 Pyramid Semiconductor Corporation M38510/23112BWX vs P4C422-20PM
AM93412A/DMC Standard SRAM, 256X4, 45ns, TTL, CDIP22, HERMETIC SEALED, CERAMIC, DIP-22 AMD M38510/23112BWX vs AM93412A/DMC
P4C422-25DM Standard SRAM, 256X4, 25ns, CMOS, CDIP22, 0.400 INCH, CERAMIC, DIP-22 Pyramid Semiconductor Corporation M38510/23112BWX vs P4C422-25DM

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