Part Details for M93C66-BN3 by STMicroelectronics
Overview of M93C66-BN3 by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for M93C66-BN3
M93C66-BN3 CAD Models
M93C66-BN3 Part Data Attributes:
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M93C66-BN3
STMicroelectronics
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Datasheet
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M93C66-BN3
STMicroelectronics
256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, PLASTIC, DIP-8
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | PLASTIC, DIP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Alternate Memory Width | 8 | |
| Clock Frequency-Max (fCLK) | 2 MHz | |
| Data Retention Time-Min | 40 | |
| Endurance | 1000000 Write/Erase Cycles | |
| JESD-30 Code | R-PDIP-T8 | |
| JESD-609 Code | e0 | |
| Length | 9.27 mm | |
| Memory Density | 4096 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256X16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | SERIAL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.33 mm | |
| Serial Bus Type | MICROWIRE | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.0015 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Lead (Sn60Pb40) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm | |
| Write Cycle Time-Max (tWC) | 10 ms | |
| Write Protection | SOFTWARE |
Alternate Parts for M93C66-BN3
This table gives cross-reference parts and alternative options found for M93C66-BN3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M93C66-BN3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M93C66-BN3/S | 256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, PLASTIC, DIP-8 | STMicroelectronics | M93C66-BN3 vs M93C66-BN3/S |
| M93C66-BN3G | 256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, PLASTIC, DIP-8 | STMicroelectronics | M93C66-BN3 vs M93C66-BN3G |
| M93C66-BN3/W | 256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, PLASTIC, DIP-8 | STMicroelectronics | M93C66-BN3 vs M93C66-BN3/W |
| M93C66-BN3P/S | 256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8 | STMicroelectronics | M93C66-BN3 vs M93C66-BN3P/S |
| AT93C66-10PA-5.0C | EEPROM, 256X16, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, MS-001BA, DIP-8 | Atmel Corporation | M93C66-BN3 vs AT93C66-10PA-5.0C |
| NM93C66MN | EEPROM, 256X16, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | Fairchild Semiconductor Corporation | M93C66-BN3 vs NM93C66MN |
| M93C66-BN3G/W | 256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8 | STMicroelectronics | M93C66-BN3 vs M93C66-BN3G/W |
| AT93C66A-10PA-5.0C | EEPROM, 256X16, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, MS-001BA, DIP-8 | Atmel Corporation | M93C66-BN3 vs AT93C66A-10PA-5.0C |
| NM93C66EN | 256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | Texas Instruments | M93C66-BN3 vs NM93C66EN |
| M93C66-BN7G | 256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8 | STMicroelectronics | M93C66-BN3 vs M93C66-BN7G |