Part Details for MAX5852ETL by Rochester Electronics LLC
Overview of MAX5852ETL by Rochester Electronics LLC
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Part Details for MAX5852ETL
MAX5852ETL CAD Models
MAX5852ETL Part Data Attributes
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MAX5852ETL
Rochester Electronics LLC
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Datasheet
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MAX5852ETL
Rochester Electronics LLC
DUAL, PARALLEL, 8 BITS INPUT LOADING, 0.012us SETTLING TIME, 8-BIT DAC, QCC40, 6 X 6 MM, 0.8 MM HEIGHT, MO-220-WJJD-2, TQFN-40
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| Pbfree Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | QFN | |
| Package Description | 6 X 6 MM, 0.8 MM HEIGHT, MO-220-WJJD-2, TQFN-40 | |
| Pin Count | 40 | |
| Reach Compliance Code | unknown | |
| Analog Output Voltage-Max | 1.25 V | |
| Analog Output Voltage-Min | -1 V | |
| Converter Type | D/A CONVERTER | |
| Input Bit Code | COMPLEMENTARY BINARY | |
| Input Format | PARALLEL, 8 BITS | |
| JESD-30 Code | S-XQCC-N40 | |
| JESD-609 Code | e0 | |
| Length | 6 mm | |
| Linearity Error-Max (EL) | 0.0977% | |
| Moisture Sensitivity Level | 1 | |
| Number of Bits | 8 | |
| Number of Functions | 2 | |
| Number of Terminals | 40 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 245 | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 0.8 mm | |
| Settling Time-Nom (tstl) | 0.012 µs | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 6 mm |