There are no models available for this part yet.
Overview of MB814100-10P by FUJITSU Limited
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| AD5752RBREZ | Analog Devices | Dual 16Bit DAC 8 LSB INL + 10p | |
| AD5752RBREZ-REEL7 | Analog Devices | Dual 16Bit DAC 8 LSB INL + 10p | |
| LTC2634CMSE-HMI10#TRPBF | Analog Devices | 4x 12-/10-/8-B R2R DACs w/ 10p |
CAD Models for MB814100-10P by FUJITSU Limited
Part Data Attributes for MB814100-10P by FUJITSU Limited
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
FUJITSU LTD
|
|
Part Package Code
|
DIP
|
|
Package Description
|
DIP, DIP18,.3
|
|
Pin Count
|
18
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.02
|
|
Access Time-Max
|
100 ns
|
|
I/O Type
|
SEPARATE
|
|
JESD-30 Code
|
R-PDIP-T18
|
|
JESD-609 Code
|
e0
|
|
Memory Density
|
4194304 bit
|
|
Memory IC Type
|
FAST PAGE DRAM
|
|
Memory Width
|
1
|
|
Number of Terminals
|
18
|
|
Number of Words
|
4194304 words
|
|
Number of Words Code
|
4000000
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
4MX1
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
DIP
|
|
Package Equivalence Code
|
DIP18,.3
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Qualification Status
|
Not Qualified
|
|
Refresh Cycles
|
1024
|
|
Self Refresh
|
NO
|
|
Standby Current-Max
|
0.001 A
|
|
Supply Current-Max
|
0.065 mA
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|