Part Details for MB90F884BHPF by FUJITSU Limited
Overview of MB90F884BHPF by FUJITSU Limited
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for MB90F884BHPF
MB90F884BHPF CAD Models
MB90F884BHPF Part Data Attributes:
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MB90F884BHPF
FUJITSU Limited
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MB90F884BHPF
FUJITSU Limited
Microcontroller, 16-Bit, FLASH, F2MC-16LX CPU, 33MHz, CMOS, PQFP100, 14 X 20 MM, 3.35 MM HEIGHT, 0.65 MM PITCH, PLASTIC, QFP-100
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FUJITSU LTD | |
| Package Description | QFP, QFP100,.7X.9 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 16 | |
| CPU Family | F2MC-16LX | |
| Clock Frequency-Max | 50 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 16 | |
| JESD-30 Code | R-PQFP-G100 | |
| JESD-609 Code | e0 | |
| Length | 20 mm | |
| Number of I/O Lines | 83 | |
| Number of Terminals | 100 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 30720 | |
| ROM (words) | 524288 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 3.35 mm | |
| Speed | 33 MHz | |
| Supply Current-Max | 50 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |