Part Details for MBM27C1001-15Z by FUJITSU Limited
Overview of MBM27C1001-15Z by FUJITSU Limited
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for MBM27C1001-15Z
MBM27C1001-15Z CAD Models
MBM27C1001-15Z Part Data Attributes
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MBM27C1001-15Z
FUJITSU Limited
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Datasheet
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MBM27C1001-15Z
FUJITSU Limited
128KX8 UVPROM, 150ns, CDIP32, CERDIP-32
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | FUJITSU SEMICONDUCTOR AMERICA INC | |
Part Package Code | DIP | |
Package Description | WDIP, | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 150 ns | |
JESD-30 Code | R-GDIP-T32 | |
Length | 41.91 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 128KX8 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.84 mm | |
Supply Current-Max | 0.04 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for MBM27C1001-15Z
This table gives cross-reference parts and alternative options found for MBM27C1001-15Z. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MBM27C1001-15Z, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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5962-8961405XX | UVPROM, 128KX8, 150ns, CMOS, CDIP32 | Teledyne e2v | MBM27C1001-15Z vs 5962-8961405XX |
M5M27C100K-15 | UVPROM, 128KX8, 150ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-32 | Mitsubishi Electric | MBM27C1001-15Z vs M5M27C100K-15 |
M27C1000-15F6 | 128KX8 UVPROM, 150ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32 | STMicroelectronics | MBM27C1001-15Z vs M27C1000-15F6 |
HN27C301AG-15 | 128KX8 UVPROM, 150ns, CDIP32, 0.600 INCH, CERDIP-32 | Renesas Electronics Corporation | MBM27C1001-15Z vs HN27C301AG-15 |
NM27C010Q150 | 128KX8 UVPROM, 150ns, CDIP32, WINDOWED, CERAMIC, DIP-32 | Texas Instruments | MBM27C1001-15Z vs NM27C010Q150 |
5962-8961405QXX | IC 128K X 8 UVPROM, 150 ns, CDIP32, 0.600 INCH, CERAMIC, DIP-32, Programmable ROM | Texas Instruments | MBM27C1001-15Z vs 5962-8961405QXX |
5962-8961410MXX | UVPROM, 128KX8, 150ns, CMOS, CDIP32 | Teledyne e2v | MBM27C1001-15Z vs 5962-8961410MXX |
MBM27C1000-15Z | Memory IC | FUJITSU Limited | MBM27C1001-15Z vs MBM27C1000-15Z |
M27C1001-15XF1 | 128KX8 UVPROM, 150ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 | STMicroelectronics | MBM27C1001-15Z vs M27C1001-15XF1 |
FM27C010Q150 | UVPROM, 128KX8, 150ns, CMOS, CDIP32, WINDOWED, CERDIP-32 | Rochester Electronics LLC | MBM27C1001-15Z vs FM27C010Q150 |