Part Details for MC8640DTVU1000HE by NXP Semiconductors
Results Overview of MC8640DTVU1000HE by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MC8640DTVU1000HE Information
MC8640DTVU1000HE by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for MC8640DTVU1000HE
| Part # | Distributor | Description | Stock | Price | Buy | |
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Flip Electronics | Stock | 7111 |
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RFQ |
US Tariff Estimator: MC8640DTVU1000HE by NXP Semiconductors
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for MC8640DTVU1000HE
MC8640DTVU1000HE Part Data Attributes
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MC8640DTVU1000HE
NXP Semiconductors
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Datasheet
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MC8640DTVU1000HE
NXP Semiconductors
RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA1023
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Package Description | Hbga, Bga1023,32x32,40 | |
| Reach Compliance Code | Unknown | |
| ECCN Code | 3A991.a.2 | |
| HTS Code | 8542.31.00.25 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | Yes | |
| Clock Frequency-Max | 166.66 Mhz | |
| External Data Bus Width | 32 | |
| Format | Floating Point | |
| Integrated Cache | Yes | |
| JESD-30 Code | S-CBGA-B1023 | |
| Length | 33 Mm | |
| Low Power Mode | No | |
| Number of DMA Channels | 4 | |
| Number of Terminals | 1023 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | Ceramic, Metal-Sealed Cofired | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1023,32X32,40 | |
| Package Shape | Square | |
| Package Style | Grid Array, Heat Sink/Slug | |
| Seated Height-Max | 2.77 Mm | |
| Speed | 1000 Mhz | |
| Supply Voltage-Max | 1.1 V | |
| Supply Voltage-Min | 1 V | |
| Supply Voltage-Nom | 1.05 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Industrial | |
| Terminal Form | Ball | |
| Terminal Pitch | 1 Mm | |
| Terminal Position | Bottom | |
| Width | 33 Mm | |
| uPs/uCs/Peripheral ICs Type | Microprocessor, Risc |
MC8640DTVU1000HE Frequently Asked Questions (FAQ)
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The recommended operating temperature range for the MC8640DTVU1000HE is -40°C to 105°C, but it's essential to note that the device can operate at a wider temperature range with reduced performance and reliability.
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To optimize power consumption, ensure that the device is operated at the lowest possible voltage and frequency required for the application. Additionally, use power-saving modes, such as sleep or standby, when the device is not in use. Properly configuring the power management unit (PMU) and using low-power peripherals can also help reduce power consumption.
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The MC8640DTVU1000HE's DDR memory interface has limitations on the maximum memory size, speed, and timing. The device supports up to 1 GB of DDR memory, with a maximum clock frequency of 133 MHz. Additionally, the memory interface has specific timing requirements, such as tRAS, tRCD, and tRP, which must be met to ensure reliable operation.
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To ensure reliable booting, ensure that the boot mode is correctly configured, and the boot device (e.g., NAND flash or SD card) is properly connected and configured. Additionally, verify that the boot loader is correctly programmed and that the device is powered on correctly, with a stable power supply and clock signal.
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When designing a PCB with the MC8640DTVU1000HE, consider the device's thermal requirements, such as heat sink design and thermal vias. Ensure that the PCB layout meets the device's signal integrity and electromagnetic interference (EMI) requirements. Additionally, follow NXP's recommended PCB design guidelines and layout recommendations to ensure reliable operation.