Part Details for MPC5553MZP132R2 by Freescale Semiconductor
Overview of MPC5553MZP132R2 by Freescale Semiconductor
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Part Details for MPC5553MZP132R2
MPC5553MZP132R2 CAD Models
MPC5553MZP132R2 Part Data Attributes
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MPC5553MZP132R2
Freescale Semiconductor
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Datasheet
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MPC5553MZP132R2
Freescale Semiconductor
IC,MICROCONTROLLER,32-BIT,CMOS,BGA,416PIN,PLASTIC
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA416,26X26,40 | |
Pin Count | 416 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.31.00.01 | |
Bit Size | 32 | |
JESD-30 Code | S-PBGA-B416 | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 416 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA416,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
ROM (words) | 1572864 | |
ROM Programmability | FLASH | |
Speed | 132 MHz | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | TIN LEAD SILVER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 |