Part Details for MPC5553MZQ132 by NXP Semiconductors
Overview of MPC5553MZQ132 by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MPC5553MZQ132
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
51M5619
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Newark | Nxp 32-Bit Mcu, Power Arch, 1.5Mb Flash, 132Mhz, -40/+125Degc, Automotive Grade, Pbga 324 Rohs Compliant: Yes |Nxp MPC5553MZQ132 RoHS: Compliant Min Qty: 300 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$51.7600 | Buy Now |
DISTI #
MPC5553MZQ132-ND
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DigiKey | IC MCU 32BIT 1.5MB FLASH 324PBGA Min Qty: 300 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$49.3875 | Buy Now |
DISTI #
MPC5553MZQ132
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Avnet Americas | MCU 32-bit MPC55xx e200 RISC 1536KB Flash 1.8V/2.5V/3.3V/5V 324-Pin BGA Tray - Trays (Alt: MPC5553MZQ132) RoHS: Not Compliant Min Qty: 300 Package Multiple: 300 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$47.9059 | Buy Now |
DISTI #
841-MPC5553MZQ132
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Mouser Electronics | 32-bit Microcontrollers - MCU MPC5553 REV A Qorivva RoHS: Not Compliant | 300 |
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$55.8700 / $75.7100 | Buy Now |
DISTI #
MPC5553MZQ132
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Avnet Silica | MCU 32-bit MPC55xx e200 RISC 1536KB Flash 1.8V/2.5V/3.3V/5V 324-Pin BGA Tray (Alt: MPC5553MZQ132) RoHS: Not Compliant Min Qty: 60 Package Multiple: 60 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
MPC5553MZQ132
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EBV Elektronik | MCU 32-bit MPC55xx e200 RISC 1536KB Flash 1.8V/2.5V/3.3V/5V 324-Pin BGA Tray (Alt: MPC5553MZQ132) RoHS: Not Compliant Min Qty: 60 Package Multiple: 60 Lead time: 14 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for MPC5553MZQ132
MPC5553MZQ132 CAD Models
MPC5553MZQ132 Part Data Attributes
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MPC5553MZQ132
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MPC5553MZQ132
NXP Semiconductors
32-BIT, FLASH, 132MHz, MICROCONTROLLER, PBGA324
|
Rohs Code | No | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 23 X 23 MM, 1 MM PITCH, PLASTIC, MS-034AAJ-1, BGA-324 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 12 Weeks | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Additional Feature | ALSO REQUIRES 3.3V SUPPLY | |
Address Bus Width | 24 | |
Bit Size | 32 | |
Clock Frequency-Max | 20 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B324 | |
JESD-609 Code | e0 | |
Length | 23 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 324 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA324,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
ROM (words) | 1572864 | |
ROM Programmability | FLASH | |
Seated Height-Max | 2.55 mm | |
Speed | 132 MHz | |
Supply Current-Max | 510 mA | |
Supply Voltage-Max | 1.65 V | |
Supply Voltage-Min | 1.35 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 23 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |