Part Details for MPC875VR133 by NXP Semiconductors
Overview of MPC875VR133 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (3 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MPC875VR133
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
40K7721
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Newark | Ic, 32-Bit Mpu, 133Mhz, Bga-256, Product Range:Mpc8Xx Series, No. Of Cpu Cores:1Cores, Program Memory Size:16Kb, Ic Case/Package:Bga, No. Of Pins:256Pins, Supply Voltage Min:1.7V, Supply Voltage Max:1.9V, No. Of I/O S:77I/O S Rohs Compliant: Yes |Nxp MPC875VR133 Min Qty: 300 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Part Details for MPC875VR133
MPC875VR133 CAD Models
MPC875VR133 Part Data Attributes:
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MPC875VR133
NXP Semiconductors
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MPC875VR133
NXP Semiconductors
32-BIT, 133MHz, RISC PROCESSOR, PBGA256
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | LEAD FREE, PLASTIC, BGA-256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA256,16X16,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 245 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.54 mm | |
| Speed | 133 MHz | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MPC875VR133
This table gives cross-reference parts and alternative options found for MPC875VR133. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC875VR133, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC875ZT133 | 32-BIT, 133MHz, RISC PROCESSOR, PBGA256 | NXP Semiconductors | MPC875VR133 vs MPC875ZT133 |
| MPC875ZT133 | 32-BIT, 133MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, PLASTIC, BGA-256 | Motorola Mobility LLC | MPC875VR133 vs MPC875ZT133 |
| MPC875ZT133 | 32-BIT, 133MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | Freescale Semiconductor | MPC875VR133 vs MPC875ZT133 |